Fabrication of application specific integrated passive devices using wafer level packaging technologies

IEEE Transactions on Advanced Packaging

Volumn 30, Issue 3, 2007, Pages 359-368

  Zoschke, Kai ^a   Wolf, M Jürgen ^a   Töpper, Micheal ^a   Ehrmann, Oswin ^a   Fritzsch, Thomas ^a   Kaletta, Katrin ^a   Schmückle, Franz Josef ^b   Reichl, Herbert ^a  

^a FRAUNHOFER IZM   (Germany)

^b LEIBNIZ INSTITUT FÜR HÖCHSTFREQUENZTECHNIK   (Germany)

Author keywords

Advanced packaging; Embedded passives; Integrated passive devices; Integrated passives; Radio frequency (RF) components; System in package (SiP); Wafer level packaging

Indexed keywords

FABRICATION; FLIP CHIP DEVICES; SURFACE MOUNT TECHNOLOGY; THIN FILMS; WSI CIRCUITS;

ADVANCED PACKAGING; EMBEDDED PASSIVES; INTEGRATED PASSIVE DEVICES; RADIO-FREQUENCY (RF) COMPONENTS; SYSTEM-IN-PACKAGE (SIP); WAFER LEVEL PACKAGING;

ELECTRONICS PACKAGING;

EID: 34548189257     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2007.901770     Document Type: Article

References (15)

1. J. Dougherty, "The NEMI roadmap: Integrated passives technology and economics," presented at the Capacitor Resistor Technol. Symp. (CARTS), Scottsdale, AZ, Apr. 2003.
2. H. Reichl and J. Wolf, "Microelectronic packaging - Ready for the next product generation," presented at the HDI Conf., Santa Clara, CA, Apr. 17-20, 2001.
3. P. Garrou, "Wafer level chip scale packaging (WL-CSP): An overview," IEEE Trans. Adv. Packag., vol. 23, no. 2, pp. 198-205, May 2000.
4. P. Ramm, A. Klumpp, R. Merkel, J. Weber, R. Wieland, A. Ostmann, J. Wolf, and H. Reichl, "3-D system integration technologies," in Mater. Res. Soc. Spring Meeting, 2003, vol. 766, pp. 3-14.
5. M. Töpper, K. Scherpinski, A. Spörle, C. Landesberger, O. Ehrmann, and H. Reichl, "Thin Chip Integration (TCI-modules) - A novel technique for manufactruing three dimensional IC-packages," in Int. Symp. Microelectron., Boston, MA, Sep. 20-22, 2000.
6. Prismark Partners LLC, Pushing the shrinking envelope - A status report on embedded passives in PWBs Cold Spring Harbor, NY, Dec. 2000.
7. M. Topper, E. Jung, K.-F. Becker, V. Glaw, K. Zoschke, T. Fritzsch, O. Ehrmann, R. Aschenbrenner, and H. Reichl, "Evolution of WLP: From redistribution to 3-D packaging and MEMs packaging," presented at the Int. Wafer Level Packag. Congress, San Diego, CA, Oct. 10-12, 2004.
8. K. Zoschke, J. Wolf, M. Topper, O. Ehrmann, T. Fritzsch, K. Scherpinski, H. Reichl, and F. J. Schmückle, "Thin film integration of passives - Single components, filters, integrated passive devices," presented at the 54th Electronic Compon. Technol. Conf., Las Vegas, NV, Jun. 1-4, 2004.
9. P. Pieters, W. De Raedt, and E. Beyne, "MCM-D technology for integrated passive components," presented at the 11th Int. Conf. Microelectron., Meridien, Kuwait, Nov. 22-24, 1999.
10. M. Töpper, V. Glaw, R. Hahn, M. Schaldach, and H. Reichl, "Thin film multilayer wiring with photosensitive BCB on ceramic, thick film- and LTCC-substrates for MCMs," in SMT/ES&H/Hybrid '97 (in German), Nünberg, Germany, Apr. 22-24, 1997.
11. M. Topper, O. Ehrmann, H. Reichl, V. Glaw, J. Wolf, G. Fischbeck, and K. Petermann, "BCB - A polymer for thin film applications," presented at the MicroMat 1997, Berlin, Germany, Apr. 16-18, 1997.
12. T. Fritzsch, K. Zoschke, O. Ehrmann, J. Wolf, M. Töpper, K. Buschick, V. Glaw, and H. Reichl, "Modul for the transmission of MPEG-4 video data using Bluetooth - Components and packaging," presented at the Micro System Technol. MST 2003, Munich, Germany, Oct. 7-8, 2003.
13. S. P. Morgan, "Effect of surface roughness on Eddy current losses at microwave frequencies," J. Appl. Phys., vol. 20, pp. 352-362, Apr. 1949.
14. R. Ulrich and L. Schaper, Integrated Passive Component Technology. New York: Wiley Interscience IEEE Press, 2003.
15. K. Scherpinski, M. Töpper, F. Krause, K. Halser, R. Hahn, O. Ehrmann, and H. Reichl, "Integration of NiCr resistors in a multi-layer Cu/BCB wiring system," in Int. Symp. Exhibition Adv. Packag. Materials, Braselton, GA, USA, Mar. 14-17, 1999, pp. 178-185.