Thermoelectric mini-contact cooler for hot-spot removal in high power devices

Proceedings - Electronic Components and Technology Conference

Volumn 2006, Issue , 2006, Pages 997-1002

  Yang, Bao ^a   Wang, Peng ^a   Bar Cohen, Avram ^a  

^a UNIVERSITY OF MARYLAND   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COOLING FLUX; HOT SPOT COOLING; INTEGRATED HEAT SPREADER (IHS); THERMOELECTRIC COOLERS (TEC);

COOLING; ELECTRONICS PACKAGING; HEAT SINKS; MICROPROCESSOR CHIPS; POWER ELECTRONICS; PRODUCT DESIGN;

THERMOELECTRICITY;

EID: 33845573806     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2006.1645775     Document Type: Conference Paper

References (15)

1. iNEMI, "Electronics Manufacturing Initiative Technology Roadmap," http://www.nemi.org, 2004.
2. A. Watwe and R. Viswanath, "Thermal Implications of Non-Uniform Die Power Map and CPU Performance," presented at Proceedings of InterPACK'03, Maui, Hawaii, USA, 2003.
3. A. Bar-Cohen and P. Rodgers, "Thermal Management of Nanoelectrics: Needs, Options, and Barriers," presented at 7th Annual Topical Research Conference on Reliability, SEMATECH, Austin, Texas, USA, 2004.
4. T. C. Harman, P. J. Taylor, M. P. Walsh, and B. E. LaForge, "Quantum Dot Superlattice Thermoelectric Materials and Devices," Science, vol. 297, pp. 2229-2232, 2002.
5. B. Yang, J. L. Liu, K. L. Wang, and G. Chen, "Simultaneous Measurements of Seebeck Coefficient and Thermal Conductivity Across Superlattice," Applied Physics Letters, vol. 80, pp. 1758-1760, 2002.
6. G. Chen, B. Yang, and W. L. Liu, "Engineering Nanostructures for Energy Conversion," in Heat Transfer and Fluid Flow in Microscale and Nanoscale Structures, M. Faghri and B. Sunden, Eds.: WIT Press, 2004, pp. 45-91.
7. A. Shakouri and Y. Zhang, "On-chip Solid-State Cooling for Integrated Circuits Using Thin-Film Microrefrigerators," IEEE Transactions On Components And Packaging Technologies, vol. 28, pp. 65-69, 2005.
8. Y. Zhang, G. H. Zeng, J. Piprek, A. Bar-Cohen, and A. Shakouri, "Superlattice Microrefrigerators Fusion Bonded with Optoelectronic Devices," IEEE Transactions On Components And Packaging Technologies, vol. 28, pp. 658-666, 2005.
9. D. M. Rowe, "CRC Handbook of Thermoelectrics." Boca Raton, FL: CRC, 1995.
10. http://www.marlow.com/.
11. R. E. Simons, M. J. Ellsworth, and R. C. Chu, "An Assessment of Module Cooling Enhancement with Thermoelectric Coolers," Journal Of Heat Transfer-Transactions Of The ASME, vol. 127, pp. 76-84, 2005.
12. B. Yang and A. Bar-Cohen, "Thermal Management Of Systems Having Localized Regions of Elevated Heat Flux.", USA, 2005, in Pending.
13. P. Wang, A. Bar-Cohen, B. Yang, G. L. Solbrekken, Y. Zhang, and A. Shakouri, "Thermoelectric Micro-cooler for Hotspot Thermal Management," presented at Proceedings of InterPACK'05, San Francisco, California, USA, 2005.
14. G. L. Solbrekken, Y. Zhang, A. Bar-Cohen, and A. Shakouri, "Use of Superlattice Thermionic Emission for "Hot-spot" Reduction in Convectively-cooled Chip," presented at Proceedings of the 9th Intersociety Conference on Thermal and Thermo-mechanical Phenomena in Electronic Systems, Las Vegas, Nevada, USA, 2004.
15. B. Yang and G. Chen, "Thermal Conductivity of Thin Films and Superlattices Materials," in Thermal Conductivity: Theory, Properties, and Applications, T. Tritt, Ed.: Kluwer Academic, 2005, pp. 167-184.