Development of capacitive ultrasonic sensor with parylene diaphragm using micromachining technique

Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers

Volumn 46, Issue 7 B, 2007, Pages 4595-4601

  Aoyagi, Seiji ^a   Furukawa, Katsuhide ^a   Yamashita, Kaoru ^b   Tanaka, Tsunehisa ^c   Inoue, Koji ^c   Okuyama, Masanori ^b  

^a KANSAI UNIVERSITY   (Japan)

^b OSAKA UNIVERSITY   (Japan)

^c OSAKA MUNICIPAL TECHNICAL RESEARCH INSTITUTE   (Japan)

Author keywords

Acoustic hole; Capacitive ultrasonic senor; Damping; Directivity; Micromachining; Parylene; Ranging system; Sensitivity

Indexed keywords

CMOS INTEGRATED CIRCUITS; DAMPING; DIAPHRAGMS; MICROMACHINING;

ACOUSTIC HOLE; CAPACITIVE ULTRASONIC SENOR; PARYLENE; RANGING SYSTEM;

ULTRASONIC SENSORS;

EID: 34547911428     PISSN: 00214922     EISSN: 13474065     Source Type: Journal    
DOI: 10.1143/JJAP.46.4595     Document Type: Article

References (29)

1. S. Aoyagi: J. Jpn. Soc. Precis. Eng. 62 (1996) 373 [in Japanese].
2. W. Mitsuhashi: IEEJ Trans. Sens. Micromach. 117-E (1997) 201 [in Japanese].
3. S. Aoyagi and K. Takehata: Integrated Comput.-Aided Eng. 8 (2001) 105.
4. Y. Mitsuida: Onkyo Kogaku (Acoustic Engineering) (Shokodo, Tokyo, 1987) p. 64 [in Japanese].
5. K. Yamashita, H. Katata, M. Okuyama, H. Miyoshi, G. Kato, S. Aoyagi, and Y. Suzuki: Sens. Actuators A 97-98 (2002) 302.
6. N. Ono, T. Arita, Y. Senjo, and S. Ando: Proc. Transducers'05, 2005, p. 792.
7. R. O. Guldiken and F. L. Degertekin: Proc. MEMS'05, 2005, p. 315.
8. Condenser Microphones Data Handbook (Brüel & Kjær, Nærum, Denmark, 1982) p. 1.
9. K. Sasaki, M. Takano, and K. Akeno: J. Fac. Eng. Univ. Tokyo, Ser. B 49 (1988) 209.
10. B. M. Diamond, J. J. Neumann, and K. J. Gabriel: Proc. MEMS'02, 2002, p. 292.
11. G. T. A. Kovacs: Miromachined Transducers Sourcebook (McGraw-Hill, Boston, 1998) p. 261.
12. P. R. Scheeper, A. G. H. Donk, W. Olthuis, and P. Bergveld: J. Microelectromech. Syst. 1 (1992) 147.
13. J. Bergqvist and J. Gobet: J. Microelectromech. Syst. 3 (1994) 69.
14. M. Ikeda, N. Shimizu, and M. Esashi: Proc. Transducers'99, 1999, p. 1070.
15. J. Chen, L. Liu, Z. Li, Z. Tan, Y. Xu, and J. Ma: Proc. MEMS'02, 2002, p. 284.
16. D. T. Martin, K. Kadirval, J. Liu, R. M. Fox, M. Sheplak, and T. Nishida: Proc. MEMS'05, 2005, p. 319.
17. Surface Mount Microphones (Knowles Acoustics, Itasca, IL, 2002).
18. X. C. Jin, S. Calmes, C. H. Cheng, F. L. Degertekin, and B. T. Khuri-Yakub: Proc. Tranducers'99, 1999, p. 1500.
19. X. Zhuang, A. S. Ergun, O. Oralkan, I. O. Wygant, and B. T. Khuri-Yakub: Proc. MEMS'06, 2006, p. 270.
20. M. Pederson, W. Olthuis, and P. Bergveld: J. Microelectromech. Syst. 7 (1998) 387.
21. W. H. Hsieh, T. J. Yao, and Y. C. Tai: Proc. Transducers'99, 1999, p. 1064.
22. Y. C. Tai: Proc. 20th Sensor Symp., 2003, p. 1.
23. K. Furukawa and S. Aoyagi: Proc. Symp. Ultrasonic Electronics, 2006, Vol. 27, p. 435.
24. S. Aoyagi, Y. Kamiya, and S. Okabe: Proc. 12th Symp. Ultrasonic Electronics, Jpn. J. Appl. Phys. 31 (1992) Suppl. 31-1, p. 263.
25. H. Sato, S. Okabe, and Y. Iwata: Kikai Shindogaku (Kougyo Chosakai Publishing, Tokyo, 1993) p. 181 [in Japanese].
26. T. A. Harder, T. Yao, Q. He, C. Y. Shih, and Y. C. Tai: Proc. MEMS'02, 2002, p. 435.
27. S. Aoyagi, D. Yoshikawa, K. Makihira, and Y. C. Tai: Proc. ASME Int. Mechanical Engineering Congr. (IMECE'04), 2004, CD-ROM no. 61472.
28. Z. Škvor: Acoustica 19 (1967) 295.
29. T. J. Yao, Q. He, X. Yang, and Y. C. Tai: Proc. Transducers'01, 2001, p. 652.