Fabrication and mechanical characterization of micro electro mechanical system based vertical probe tips for micro pad measurements

Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers

Volumn 45, Issue 12, 2006, Pages 9238-9243

  Ryu, Jaewook ^a   Kim, Jin Hyuk ^a   Chu, Sung Il ^a   Lee, SeungHun ^a   Moon, Sung ^a  

^a Korea Institute of Science and Technology   (South Korea)

Author keywords

Bulk micromachining; Compression test; Electro plating; MEMS probe card; Vertical probe tip

Indexed keywords

COMPRESSION TESTING; ELECTROPLATING; FINITE ELEMENT METHOD; SEMICONDUCTOR DEVICES; SILICON WAFERS;

BULK-MICROMACHINING; MEMS PROBE CARD; VERTICAL PROBE TIP;

MEMS;

EID: 34547905795     PISSN: 00214922     EISSN: 13474065     Source Type: Journal    
DOI: 10.1143/JJAP.45.9238     Document Type: Article

References (9)

1. K. Kataoka, T. Itoh, K. Inoue and T. Suga: IEEE Int. Conf. Micro Electro Mechanical Systems, 2004, Vol. 17, p. 733.
2. K. Kim, J. Kim, S. Jeong, J. Kim and H. Lee: Korea Micro Electro Mechanical Systems Conf., 2005, p. 381.
3. N. Sporck: Proc. 1997 Int. Test Conf., 1997, p. 527.
4. T. Do, S. Splinter, C. Chen and N. McIntyre: Surf. Sci. 387 (1997) 192.
5. K. Kataoka, S. Kawamura, T. Itoh, K. Ishikawa, H. Honma and T. Suga: Sens. Actuators A 130 (2003) 116.
6. T. Zhang, Y. Zhang, D. Morrow and R. Marcus: Proc. 1997 Int. Workshop Micro Electro Mechanical Systems Conf., 1997, p. 395.
7. T. Itoh, T. Suga, G. Engelmann, J. Wolf, O. Ehrmann and H. Reichl: Proc. 1999 Int. PACK, 1999, p. 123.
8. T. Itoh, R. Sawada and E. Higurashi: Proc. 1999 Micro Electro Mechanical Systems, 1999, p. 263.
9. T. Itoh, K. Kataoka and T. Suga: Sens. Actuators A 97-98 (2002) 462.