Thermal behaviour of CpCuPEt3 in gas phase and Cu thin films processing

Surface and Coatings Technology

Volumn 201, Issue 22-23 SPEC. ISS., 2007, Pages 9131-9134

  Senocq, F ^a   Turgambaeva, A ^b   Prud'homme, N ^a   Patil, U ^a   Krisyuk, V V ^b   Samelor D ^a   Gleizes, A ^a   Vahlas, C ^a  

^a INSTITUT CARNOT CIRIMAT   (France)

^b ENERGY SYSTEMS INSTITUTE   (Russian Federation)

Author keywords

Clapeyron law; Copper films; Mass spectrometry; Vapour pressure

Indexed keywords

COPPER; CRYSTAL MICROSTRUCTURE; DECOMPOSITION; GROWTH RATE; METALLORGANIC CHEMICAL VAPOR DEPOSITION; THERMODYNAMICS; VAPOR PRESSURE;

CLAPEYRON LAW; MOLAR FRACTION; STATIC METHOD;

INORGANIC COATINGS;

COPPER; CRYSTAL MICROSTRUCTURE; DECOMPOSITION; GROWTH RATE; INORGANIC COATINGS; METALLORGANIC CHEMICAL VAPOR DEPOSITION; THERMODYNAMICS; VAPOR PRESSURE;

EID: 34547693433     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.surfcoat.2007.05.011     Document Type: Article

References (19)

1. Murarka S.P., Gutmann R.J., Kaloyelos A.E., and Lanford W.A. Thin Solid Films, 236 (1993) 257
2. Norman J.A.T., Muratore B.A., Dyer P.N., Roberts D.A., Hochberg A.K., and Dubois L.H. Mater. Sci. Eng., B 17 (1993) 87
3. In: Li J., Blewer R., and Mayer J.W. (Eds). Copper Metallization vol. XVIII (1993), Material Research Society, Pittsburg 18-56
4. Maverick A., and Griffin G.L. In: Kodas T.T., and Hampden-Smith M.J. (Eds). The Chemistry of Metal CVD: Chapter 4 (1994), VCH, Weinheim
5. Temple D., and Reisman A. J. Electrochem. Soc., 136 11 (1989) 3525
6. Kaloyelos A.E., Feng A., Garhart J., Brooks K.C., Ghosh S.K., Saxena A.N., and Luehers F. J. Electron. Mater., 19 3 (1990) 271
7. Hampden-Smith M.J., and Kodas T.T. Polyhedron, 14 6 (1995) 699
8. Li Z., Rahtu A., and Gordon R.G. J. Electrochem. Soc., 153 11 (2006) C787
9. Wilkinson G., and Piper T.S. J. Inorg. Nucl. Chem., 2 (1956) 32
10. Whiteside G.M., and Fleming J.S. J. Am. Chem. Soc., 89 12 (1967) 2855
11. Cotton F.A., and Marks T.J. J.Am. Chem.Soc., 92 17 (1970) 5114
12. Dupuy C.G., Beach D.B., Hurst Jr. J.E., and Jasinski J.M. Chem. Mater., 1 (1989) 16
13. Hara K., Kojima T., and Kukimoto H. Jpn. J. Appl. Phys., 26 (1987) L1107
14. Kondoh E., Kawano Y., Takeyasu N., and Otha T. J. Electrochem. Soc., 141 12 (1994) 3494
15. Katagari T., Kondoh E., Takeyasu N., Nakano T., Yamamoto H., and Ohta T. Jpn. J. Appl. Phys., 32 (1993) L1078
16. Turgambaeva A.E., Krisyuk V.V., Bykov A.F., and Igumenov I.K. J. Phys. IV France, 9 (1999) Pr8-Pr65
17. F. Juarez-Lopez, M-C. Lafont, F. Senocq, C. Vahlas, Chemical Vapor Deposition XVI and EUROCVD14, M.D. Alendorf, F. Teyssandier, F. Maury eds., The Electrochem. Soc. Process.., vol 2003-08, 538.
18. T.I. Liskovskaya, L.G. Bulusheva, A.V. Okotrub; J. Phys. IV France, 11 (2001) Pr3-69 and Pr3-76.
19. Beach D.B., LeGoues F.K., and Hu C.-K. Chem. Mater., 2 (1990) 216