Fine-grain thermal profiling and sensor insertion for FPGAs

Proceedings - IEEE International Symposium on Circuits and Systems

Volumn , Issue , 2006, Pages 4387-4390

  Mondal, Somsubhra ^a   Mukherjee, Rajarshi ^a   Memik, Seda Ogrenci ^a  

^a Northwestern University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; DENSITY (SPECIFIC GRAVITY); MICROPROCESSOR CHIPS; NATURAL FREQUENCIES; SENSITIVITY ANALYSIS; SENSORS;

CLOCK FREQUENCIES; FINE GRAIN THERMAL PROFILING; LOGIC DENSITIES; SENSOR INSERTION;

FIELD PROGRAMMABLE GATE ARRAYS (FPGA);

EID: 34547346711     PISSN: 02714310     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (13)

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