Thermal testing on reconfigurable computers

IEEE Design and Test of Computers

Volumn 17, Issue 1, 2000, Pages 84-91

  Lopez Buedo, Sergio ^a   Garrido, Javier ^a   Boemo, Eduardo ^a  

^a UNIVERSIDAD AUTÓNOMA DE MADRID   (Spain)

Author keywords

[No Author keywords available]

Indexed keywords

CALIBRATION; CURRENT VOLTAGE CHARACTERISTICS; DIODES; ELECTRIC POWER SUPPLIES TO APPARATUS; ELECTRONIC EQUIPMENT TESTING; FIELD PROGRAMMABLE GATE ARRAYS; MICROPROCESSOR CHIPS; OSCILLATORS (ELECTRONIC); SENSORS; THERMAL EFFECTS; THERMOCOUPLES; THERMODYNAMIC PROPERTIES;

RECONFIGURABLE COMPUTERS; RING OSCILLATORS; THERMAL SENSORS; THERMAL TESTING;

COMPUTERS;

EID: 0033884672     PISSN: 07407475     EISSN: None     Source Type: Journal    
DOI: 10.1109/54.825679     Document Type: Article

References (20)

1. V. Székely, C. Márta, M. Rencz, and B. Courtois, "A New Approach: Design for Thermal Testability (DfTT) of MCMs," Proc. MCM Test Workshop, Napa Valley, Calif., 1995, pp. 1-3.
2. Virtual Computer Corp., VW-300: The Virtual Workbench, datasheet available at: http://www.vcc.com.
3. Giga Operations Corp., XMOD Features, 1997.
4. Xilinx Inc., Virtex 2.5 VField Programmable Gate Arrays: Advance Product Specification, May 1999.
5. National Semiconductor, "Sensing and Monitoring for Control and Protection," Analog Seminar, Lit #570141-004, 1999.
6. R. Wolffenbuttel, ed., Silicon Sensors and Circuits: On-chip compatibility. London: Chapman & Hall, 1996.
7. G. Quenot, N. Paris, and B. Zavidovique, "A Temperature and Voltage Measurement Cell for VLSI Circuits," Proc. European ASIC Conf. Piscataway, N.J.: IEEE Press, 1991, pp. 334-338.
8. P. Alfke, Contribution to the Comp. Arch. FPGA Newsgroup, Apr. 1997.
9. F. Dewey and P. Emerald, "Computing IC Temperature Rise," Allegro MicroSystems, Inc., 1997. Available at http://www.allegromicro.com/ techpub/an295014.pdf.
10. P. Gray, D. DeWitt, A. Boothroyd, and J. Gibbons, Physical Electronics and Circuit Models of Transistors. New York: John Wiley, 1964.
11. L. Mahalingam, J. Adrews, and J. Drye, "Thermal Studies on PGA Packages for High Density LSI and VLSI Logic Circuits," IEEE Trans. Components, Hybrids and Manufacturing Technology, vol. 6, no. 3, pp.246-256, Sept. 1983.
12. Xilinx Inc., "Packages Thermal Characterization Methods & Conditions," The Programmable Logic Databook, pp. 10-16, 1996.
13. M. Nishiguchi, M. Fujihara, and H. Nishizawa, "Precision Comparison of Surface Temperature Measurement Techniques for GaAs IC's," IEEE Trans. Components, Packaging and Manufacturing Technology, vol. 16, no. 5, pp. 543-549, Aug. 1993.
14. S. Rzepka, K. Banerjee, E. Meusel, and C. Hu, "Characterization of Self-Heating in Advanced VLSI Interconnect Lines Based on Thermal Finite Element Simulation," IEEE Trans. Components, Packaging and Manufacturing Technology, Part A, vol. 21, no. 3, pp. 399-409, Sept. 1998.
15. E. Boemo and S. Lopez-Buedo, Themal Monitoring on FPGAs Using Ring-Oscillators. Berlin: Springer-Verlag, 1997, pp. 69-78.
16. S. Lopez-Buedo, J. Garrido, and E. Boemo, "Thermal Testing on Programmable Logic Devices," IEEE Int'l Symp. Circuits and Systems, Monterey, Calif., June 1998, vol. 2, pp. 240-243.
17. Xilinx Inc., Xilinx Libraries Guide, 1998.
18. M. Jackson, P. Lall, and D. Das, "Thermal Deration - a Factor of Safety or Ingnorance," IEEE Trans. Components, Packaging and Manufacturing Technology, Part A, vol. 20, no. 1, pp. 83-85, Mar. 1997.
19. P. Lall, "Tutorial: Temperature as an Input to Microelectronics-Reliability Models," IEEE Trans. Reliability, vol. 45, no. 1, pp. 3-9, Mar. 1996.
20. D. Edwards, "Development of JEDEC Standard Thermal Measurement Test Boards," IEEE Trans. Components, Packaging and Manufacturing Technology, Part A, vol. 19, no. 4, pp. 478-485, Dec. 1996.