Preparation and properties of reflowed paste and bulk composite solder

National Electronic Packaging and Production Conference-Proceedings of the Technical Program (West and East)

Volumn 3, Issue , 1992, Pages 1256-1265

  Clough, Roger B ^a   Patel, Rajiv ^a   Hwang, Jennie S ^a   Lucey, George ^a  

^a NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPOSITE MATERIALS - ANALYSIS; ELECTRONICS PACKAGING - SOLDERING; ELECTRONICS PACKAGING - SURFACE MOUNT TECHNOLOGY; STRESSES - CREEP;

CREEP RATE; FLOW STRESS;

SOLDERS;

EID: 0026627199     PISSN: 04700155     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (0)