High performance packaging materials for improved thermal managements of power electronic
Moores K.A., and Joshi Y.K. High performance packaging materials for improved thermal managements of power electronic. Future Circuits Int. 7 (2001) 45-49
Copper alloy-impregnated carbon-carbon hybrid composites for electronic packaging applications
Datta S.K., Tewari S.N., Gatica J.E., Shih W., and Bentsen L. Copper alloy-impregnated carbon-carbon hybrid composites for electronic packaging applications. Metall. Mater. Trans. A 30 (1999) 175-181
Properties of high reinforcement-content aluminum matrix composite for electronic packages
Wu G., Zhang Q., Chen G., Jiang L., and Xiu Z. Properties of high reinforcement-content aluminum matrix composite for electronic packages. J. Mater. Sci. Mater. Electron. 14 (2003) 9-12
A comparison of aluminium-based metal-matrix composites reinforced with coated and uncoated particulate silicon carbide
Davidson A.M., and Regener D. A comparison of aluminium-based metal-matrix composites reinforced with coated and uncoated particulate silicon carbide. Compos. Sci. Technol. 60 (2000) 865-869
Adhesion improvements of electroless plated Ni layer by ultrasonic agitation during zincating process
Jin J.G., Lee S.K., and Kim Y.H. Adhesion improvements of electroless plated Ni layer by ultrasonic agitation during zincating process. Thin Solid Films 466 (2004) 272-278
An overview to Integrated Power Module (IPM) design for high power electronics packaging
Lostetter A.B., Barlow F., and Elshabini A. An overview to Integrated Power Module (IPM) design for high power electronics packaging. Microelectron. Reliab. (2000) 365-379