메뉴 건너뛰기




Volumn 27, Issue 13-15, 2007, Pages 3983-3986

Electroless multilayer coatings on aluminium-silicon carbide composites for electronics packaging

Author keywords

Composites; Corrosion; Films; Interfaces; SiC

Indexed keywords

ALUMINUM; CERAMIC COATINGS; CORROSION; ELECTROLESS PLATING; ELECTRONICS PACKAGING; INTERFACES (MATERIALS); MICROHARDNESS; MICROSTRUCTURE; MULTILAYERS; NANOINDENTATION; SILICON CARBIDE;

EID: 34347347161     PISSN: 09552219     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jeurceramsoc.2007.02.079     Document Type: Article
Times cited : (20)

References (8)
  • 1
    • 0013341959 scopus 로고    scopus 로고
    • High performance packaging materials for improved thermal managements of power electronic
    • Moores K.A., and Joshi Y.K. High performance packaging materials for improved thermal managements of power electronic. Future Circuits Int. 7 (2001) 45-49
    • (2001) Future Circuits Int. , vol.7 , pp. 45-49
    • Moores, K.A.1    Joshi, Y.K.2
  • 2
    • 0032757461 scopus 로고    scopus 로고
    • Copper alloy-impregnated carbon-carbon hybrid composites for electronic packaging applications
    • Datta S.K., Tewari S.N., Gatica J.E., Shih W., and Bentsen L. Copper alloy-impregnated carbon-carbon hybrid composites for electronic packaging applications. Metall. Mater. Trans. A 30 (1999) 175-181
    • (1999) Metall. Mater. Trans. A , vol.30 , pp. 175-181
    • Datta, S.K.1    Tewari, S.N.2    Gatica, J.E.3    Shih, W.4    Bentsen, L.5
  • 3
    • 0037284108 scopus 로고    scopus 로고
    • Properties of high reinforcement-content aluminum matrix composite for electronic packages
    • Wu G., Zhang Q., Chen G., Jiang L., and Xiu Z. Properties of high reinforcement-content aluminum matrix composite for electronic packages. J. Mater. Sci. Mater. Electron. 14 (2003) 9-12
    • (2003) J. Mater. Sci. Mater. Electron. , vol.14 , pp. 9-12
    • Wu, G.1    Zhang, Q.2    Chen, G.3    Jiang, L.4    Xiu, Z.5
  • 4
    • 0034060952 scopus 로고    scopus 로고
    • A comparison of aluminium-based metal-matrix composites reinforced with coated and uncoated particulate silicon carbide
    • Davidson A.M., and Regener D. A comparison of aluminium-based metal-matrix composites reinforced with coated and uncoated particulate silicon carbide. Compos. Sci. Technol. 60 (2000) 865-869
    • (2000) Compos. Sci. Technol. , vol.60 , pp. 865-869
    • Davidson, A.M.1    Regener, D.2
  • 5
    • 4544323557 scopus 로고    scopus 로고
    • Adhesion improvements of electroless plated Ni layer by ultrasonic agitation during zincating process
    • Jin J.G., Lee S.K., and Kim Y.H. Adhesion improvements of electroless plated Ni layer by ultrasonic agitation during zincating process. Thin Solid Films 466 (2004) 272-278
    • (2004) Thin Solid Films , vol.466 , pp. 272-278
    • Jin, J.G.1    Lee, S.K.2    Kim, Y.H.3
  • 6
    • 2942587255 scopus 로고    scopus 로고
    • The growth morphology and crystallinity of electroless NiP deposition on silicon.
    • Tsai T.K., and Chao C.G. The growth morphology and crystallinity of electroless NiP deposition on silicon. Appl. Surf. Sci. 233 (2004) 180-190
    • (2004) Appl. Surf. Sci. , vol.233 , pp. 180-190
    • Tsai, T.K.1    Chao, C.G.2
  • 7
    • 0033882843 scopus 로고    scopus 로고
    • An overview to Integrated Power Module (IPM) design for high power electronics packaging
    • Lostetter A.B., Barlow F., and Elshabini A. An overview to Integrated Power Module (IPM) design for high power electronics packaging. Microelectron. Reliab. (2000) 365-379
    • (2000) Microelectron. Reliab. , pp. 365-379
    • Lostetter, A.B.1    Barlow, F.2    Elshabini, A.3
  • 8
    • 33644982862 scopus 로고    scopus 로고
    • A new electroless nickel deposition technique to metallise SiCp/Al composites
    • Li L., An M., and Wu G. A new electroless nickel deposition technique to metallise SiCp/Al composites. Surf. Coat. Technol. 200 (2006) 5102-5112
    • (2006) Surf. Coat. Technol. , vol.200 , pp. 5102-5112
    • Li, L.1    An, M.2    Wu, G.3


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.