Cooling challenges and best practices for high density data and telecommunication centers

2006 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'06

Volumn , Issue , 2006, Pages 49-54

  David, Wang ^a  

^a TERADATA CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CABINET LEVELS; RAMIFICATIONS; TELECOMMUNICATION CENTERS;

AIR CONDITIONING; AVAILABILITY; COOLING; DATA PROCESSING; ELECTRIC POWER UTILIZATION; STANDARDS; TELECOMMUNICATION SYSTEMS;

INTEGRATED CIRCUITS;

EID: 34250882836     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (16)

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