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Volumn 968, Issue , 2007, Pages 51-56
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Reactive multilayer foils for silicon wafer bonding
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Author keywords
[No Author keywords available]
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Indexed keywords
HEAT SOURCES;
HERMETICITY;
MULTILAYER FOILS;
BONDING;
COMPUTER SIMULATION;
EXOTHERMIC REACTIONS;
HERMETIC DEVICES;
WAFER BONDING;
X RAY DIFFRACTION ANALYSIS;
SILICON WAFERS;
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EID: 34250822819
PISSN: 02729172
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
Times cited : (2)
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References (9)
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