Study of Cu migration-induced failure of inter-layer dielectric

IEEE International Reliability Physics Symposium Proceedings

Volumn , Issue , 2006, Pages 673-674

  Hwang, Sang Soo ^a   Jung, Sung Yup ^a   Jung, Jung Kyu ^a   Joo, Young Chang ^a  

^a Seoul National University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

BARRIER HEIGHTS; INTER LAYER DIELECTRICS; ION TRAPS;

COPPER; ELECTRIC BREAKDOWN; ELECTROMIGRATION; FAILURE ANALYSIS; MATHEMATICAL MODELS;

DIELECTRIC MATERIALS;

EID: 34250693584     PISSN: 15417026     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/RELPHY.2006.251318     Document Type: Conference Paper

References (7)

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