Design for reliability

Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA

Volumn , Issue , 2006, Pages 257-264

  Turner, Timothy E ^a  

^a 29 Woodlands Industrial Park E1   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

FAILURE MODES; MACHINE DESIGN; RELIABILITY; SEMICONDUCTOR DEVICE MANUFACTURE; THERMODYNAMIC PROPERTIES;

DESIGN FOR RELIABILITY; PARAMETRIC DISTRIBUTION;

ELECTRIC NETWORK ANALYSIS;

EID: 34250625315     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IPFA.2006.251042     Document Type: Conference Paper

References (6)

1. Nigam, T., Martin, S. and Abusch-Magder, D. "Temperature Dependence and Conduction Mechanism after Analog Soft Breakdown" Proceedings of the International Reliability Physics Symposium 2003
2. Lai, W., Sune, J., Wu, E. and Novak, E. "Impact of Stress Induced Leakage Current on Power-Consumption in Ultra-Thin Gate Oxides" Proceedings of the International Reliability Physics Symposium 2004
3. Heijmen, T., Roche, P., Gasior, G. and Forbes, K., "A Comparative Study on the Soft-Error Rate of Flip-Flops From 90-nm Production Libraries", Proceedings of the International Reliability Physics Symposium, 2006, pp. 204-211
4. Herr, D. "The Potential impact of Intrinsic Dopant Wavefront Roughness on High Frequency Line Edge Roughness Requirements", http://www.itrs.net/Common/2005ITRS/Linked%20Files/2005Files/ Metrology05Metrology_Link1_Intrinsic%20Dopant%20Wavefront%20Roughness.doc
5. Wang, G., Groothuis, S., Ho, P. "Packaging Effect on Reliability for Cu/Low K Structures", Proceedings of the Reliability Physics Symposium 2004, pp. 557-562
6. Shih, J., Wang, R., Sheu, Y., Lin, H., Wang, J. and Wu, K., "Pattern Density Effect of Trench Isolation-Induced Mechanical Stress on Device Reliability in sub-0.1um Technology", Proceedings of the International Reliability Physics Symposium 2004, pp. 489-497