Optimal feed-forward control for multizone baking in microlithography

Industrial and Engineering Chemistry Research

Volumn 46, Issue 11, 2007, Pages 3623-3628

  Ho, Weng Khuen ^a   Tay, Arthur ^a   Chen, Ming ^a   Kiew, Choon Meng ^a  

^a NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

ALGORITHMS; LINEAR PROGRAMMING; LITHOGRAPHY; OPTIMIZATION; THERMAL EFFECTS;

MULTIZONE BAKING SYSTEM; TEMPERATURE DISTURBANCE;

CONTROL SYSTEM ANALYSIS;

ALGORITHMS; CONTROL SYSTEM ANALYSIS; LINEAR PROGRAMMING; LITHOGRAPHY; OPTIMIZATION; THERMAL EFFECTS;

EID: 34250017419     PISSN: 08885885     EISSN: None     Source Type: Journal    
DOI: 10.1021/ie061011p     Document Type: Article

References (7)

1. Quirk, M.; Serda, J. Semiconductor Manufacturing Technology; Prentice Hall: Englewood Cliffs, NJ, 2001.
2. Ho, W. K.; Tay, A.; Schaper, C. D. Optimal Predictive Control with Constraints for the Processing of Semiconductor Wafers on Bake Plates. IEEE Trans. Semicond. Manuf. 2000, 13, 88.
3. Tay, A.; Ho, W. K.; Schaper, C. D.; Lee, L. L. Constraint Feedforward Control for Thermal Processing of Quartz Photomasks in Microelectronics Manufacturing. J. Process Control 2004, 14, 31.
4. Lee, L. L.; Schaper, C. D.; Ho, W. K. Real-Time Predictive Control of Photoresist Film Thickness Uniformity. IEEE Trans. Semicond. Manuf. 2002, 15, 51.
5. Ho, W. K.; Lee, L. L.; Tay, A.; Schaper, C. D. Resist Film Uniformity in the Microlithography Process. IEEE Trans. Semicond. Manuf. 2002, 15, 323.
6. Berger, L.; Dress, P.; Gairing, T. Global Critical Dimension Uniformity Improvement for Mask Fabrication with Negative-Tone Chemically Amplified Resists by Zone-controlled Postexposure Bake. J. Microlithogr., Microfabr., Microsyst. 2004, 3, 203.
7. Lee, H.-C.; Chen, C.-J.; Hsieh, H.-C.; Berger, L.; Saule, W.; Dress, P.; Gairing, T. Global CD Uniformity Improvement for CAR Masks by Adaptive Post-exposure Bake with CD Measurement Feedback. In Semiconductor Manufacturing Technology Workshop Proceedings, 2004; IEEE: Piscataway, NJ, 2004; pp 99-102.