-
1
-
-
4344598206
-
High-performance substrate from new epoxy resin and enhanced copper foil
-
L. Valette, R. Wiechmann, "High-performance substrate from new epoxy resin and enhanced copper foil", Circuit World, 30(4), 20 (2004).
-
(2004)
Circuit World
, vol.30
, Issue.4
, pp. 20
-
-
Valette, L.1
Wiechmann, R.2
-
3
-
-
84869035411
-
Spatial impact of PCB fabrication and materials on single-ended and differential impedance transmission lines
-
March
-
G. Brist, J. McCall; " Spatial Impact of PCB Fabrication and Materials on Single-Ended and Differential Impedance Transmission Lines, " PCB West/HDI Expo 2003, (March 2003).
-
(2003)
PCB West/HDI Expo 2003
-
-
Brist, G.1
McCall, J.2
-
4
-
-
0019142075
-
Accurate models for microstrip computer-aided design
-
May
-
Hammerstad and Jensen, "Accurate Models for Microstrip Computer-Aided Design", IEEE MTT-S Digest, pp407-409, May 1980.
-
(1980)
IEEE MTT-S Digest
, pp. 407-409
-
-
Hammerstad1
Jensen2
-
5
-
-
84869001579
-
Optimized system design through industry benchmarking of fabrication tolerances and material properties
-
November
-
G. Brist, G. Long, D. Sato; "Optimized System Design Through Industry Benchmarking of Fabrication Tolerances and Material Properties, " Fall IPC Mtg, (November 2003).
-
(2003)
Fall IPC Mtg
-
-
Brist, G.1
Long, G.2
Sato, D.3
-
6
-
-
42349098467
-
Fine lines in high yield (part XCVIII): Advances in reinforcement structures
-
Nov
-
K. Dietz; "Fine Lines in High Yield (Part XCVIII): Advances in Reinforcement Structures "; Circuitree; Nov 2003.
-
(2003)
Circuitree
-
-
Dietz, K.1
-
7
-
-
84869058751
-
High speed interconnects: The impact of spatial electrical properties of pcb due to woven glass reinforcement patterns
-
February
-
G. Brist, B. Horine, G. Long; "High Speed Interconnects: The Impact of Spatial Electrical Properties of PCB due to Woven Glass Reinforcement Patterns, " IPC Expo 2004, (February 2004).
-
(2004)
IPC Expo 2004
-
-
Brist, G.1
Horine, B.2
Long, G.3
-
10
-
-
0026190831
-
On the modeling of conductor and substrate losses in multi-conductor transmission line systems
-
July
-
Arabi, T, et. al., "On the Modeling of Conductor and Substrate Losses in Multi-Conductor Transmission Line Systems, " IEEE Transactions pn Microwave Theory and Techniques, Vol. 39, No. 7, July 1991.
-
(1991)
IEEE Transactions Pn Microwave Theory and Techniques
, vol.39
, Issue.7
-
-
Arabi, T.1
-
11
-
-
0035519735
-
Wideband frequency domain characterization of FR4 and time domain causality
-
November
-
A. Djordjevic, "Wideband Frequency Domain Characterization of FR4 and Time Domain Causality, " IEEE Transactions on Electromagnetic Compatibility, Vol. 43, No. 4 November 2001.
-
(2001)
IEEE Transactions on Electromagnetic Compatibility
, vol.43
, Issue.4
-
-
Djordjevic, A.1
-
12
-
-
8744295487
-
The PCB technology evolution for 10 gb/s & beyond
-
September 17-18
-
H. Heck, B. Horine, J. McCall, T. Liang, G. Brist; "The PCB Technology Evolution for 10 Gb/s & Beyond, " Intel Technology Symposium, September 17-18, 2003.
-
(2003)
Intel Technology Symposium
-
-
Heck, H.1
Horine, B.2
McCall, J.3
Liang, T.4
Brist, G.5
-
13
-
-
8744223935
-
Impact of FR4 dielectric non-uniformity on the performance of multi-Gb/s differential signals
-
October 27-29, Princeton, NJ
-
H. Heck, B. Horine, S. Hall, K. Mallory, T. Wig; "Impact of FR4 Dielectric Non-Uniformity on the Performance of Multi-Gb/s Differential Signals, "; IEEE 12th Topical Meeting on Electrical Performance of Electronic Packaging, October 27-29, 2003, Princeton, NJ pp. 243-246.
-
(2003)
IEEE 12th Topical Meeting on Electrical Performance of Electronic Packaging
, pp. 243-246
-
-
Heck, H.1
Horine, B.2
Hall, S.3
Mallory, K.4
Wig, T.5
-
15
-
-
1642318888
-
Effect of surface finish on high-frequency signal loss using various substrate materials
-
March
-
D.Cullen, B.Klein, G.Moderhock, L.Gatewood; "Effect of Surface Finish on High-Frequency Signal Loss Using Various Substrate Materials." IPC EXPO, (March 2001).
-
(2001)
IPC EXPO
-
-
Cullen, D.1
Klein, B.2
Moderhock, G.3
Gatewood, L.4
-
16
-
-
15944375879
-
Modeling requirements for transmission lines in multi-gigabit systems
-
October 25-27
-
S. Hall, et. al., "Modeling Requirements for Transmission Lines in Multi-Gigabit Systems, " IEEE Electrical Performance of Electronic Packaging Symposium, October 25-27, 2004, pp, 67-70.
-
(2004)
IEEE Electrical Performance of Electronic Packaging Symposium
, pp. 67-70
-
-
Hall, S.1
|