Bonding of silicon with filled and unfilled polymers based on black silicon

Micro and Nano Letters

Volumn 2, Issue 1, 2007, Pages 6-8

  Stubenrauch, M ^a   Fischer, M ^a   Kremin, C ^a   Hoffmann, M ^a   Muller J ^a  

^a ILMENAU UNIVERSITY OF TECHNOLOGY   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

CERAMIC MATERIALS; DUCTILITY; FLUIDICS; PLASTIC DEFORMATION; PLASTIC TAPES; SILICON WAFERS;

BLACK SILICON; CERAMIC TAPES; FILLED POLYMER COMPONENTS; FLUIDIC INTERCONNECTS;

POLYSILICON;

POLYMER; POLYPROPYLENE;

ARTICLE; CERAMICS; CHEMICAL BOND; CHEMICAL STRUCTURE; COMPUTER INTERFACE; ELECTRON BEAM; LOW TEMPERATURE; METAL BINDING;

EID: 34249812691     PISSN: None     EISSN: 17500443     Source Type: Journal    
DOI: 10.1049/mnl:20065064     Document Type: Article

References (4)

1. Wei, J.: ' Wafer bonding techniques for microsystem packaging ', J. Phys., Conf. Ser., 2006, 34, p. 943-948 1742-6588
2. Müller, E., Bartnitzek, T., Bechtold, F., Pawlowski, B., Rothe, P., Ehrt, R., Heymel, A., Weil, E., Schroeter, T., Schundau, S., and Kaschlik, K.: ' Development and Processing of an Anodic Bondable LTCC Tape ', (EMPC, 2005), Brugge, Belgium
3. Jansen, H., De Boer, M., Legtenberg, R., and Elwenspeok, M.: ' The black silicon method: A universal method for determining the parameter setting of a fluorine-based reactive ion etcher in deep silicon trench etching with profile control ', J. Micromech. Microeng., 1995, 5, p. 115-120 10.1088/0960-1317/5/2/ 015 0960-1317
4. Stubenrauch, M., Fischer, M., Kremin, C., Stoebenau, S., Albrecht, A., and Nagel, O.: ' Black silicon - new functionalities in microsystems ', J. Micromech. Microeng., 2006, 16, p. 82-87 10.1088/0960-1317/16/6/S13 0960-1317