Development of a low-melting-point filler metal for brazing aluminum alloys

Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science

Volumn 31, Issue 9, 2000, Pages 2239-2245

  Chuang, T H ^a   Yeh, M S ^b   Tsao, L C ^a   Tsai, T C ^a   Wu, C S ^c  

^a NATIONAL TAIWAN UNIVERSITY   (Taiwan)

^b CHUNG HUA UNIVERSITY   (Taiwan)

^c METAL INDUSTRIES RESEARCH AND DEVELOPMENT CENTRE   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; BRAZING FILLER METALS; COPPER ALLOYS; INTERMETALLICS; MELTING; METALLOGRAPHIC MICROSTRUCTURE; SILICON ALLOYS; THERMAL EFFECTS; THERMOANALYSIS;

BRAZABILITY;

ALUMINUM ALLOYS;

EID: 0034266895     PISSN: 10735623     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11661-000-0141-z     Document Type: Article

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