Fabrication of superhydrophobic copper by wet chemical reaction

Thin Solid Films

Volumn 515, Issue 18, 2007, Pages 7190-7194

  Guo, Zhiguang ^a,b   Fang, Jian ^a,b   Wang, Libo ^a,b   Liu, Weimin ^a  

^a LANZHOU INSTITUTE OF CHEMICAL PHYSICS   (China)

^b UNIVERSITY OF CHINESE ACADEMY OF SCIENCES   (China)

Author keywords

Copper substrate; Superhydrophobic; Water contact angle; Wet chemical reaction

Indexed keywords

CONTACT ANGLE; COPPER; HYDROPHOBICITY; MICROFABRICATION; REACTION KINETICS; THERMAL EFFECTS;

COPPER SUBSTRATES; SUPERHYDROPHOBICITY; WATER CONTACT ANGLE; WET CHEMICAL REACTIONS;

SURFACE STRUCTURE;

EID: 34249095419     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2007.02.100     Document Type: Article

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