|
Volumn 19, Issue 6, 1996, Pages 44-X4
|
New material from old
a
a
NONE
|
Author keywords
[No Author keywords available]
|
Indexed keywords
COPPER;
DIELECTRIC MATERIALS;
ENCAPSULATION;
EPOXY RESINS;
LAMINATING;
LASER ABLATION;
METAL FOIL;
MULTILAYERS;
PLASMA ETCHING;
PRINTED CIRCUIT BOARDS;
PRINTED CIRCUIT DESIGN;
FOIL LAMINATION;
RESIN COATED COPPER;
PRINTED CIRCUIT MANUFACTURE;
|
EID: 0030173995
PISSN: 02748096
EISSN: None
Source Type: Journal
DOI: None Document Type: Article |
Times cited : (3)
|
References (0)
|