On the effects of transient electromagnetic interference on integrated circuits

Electronic Device Failure Analysis

Volumn 8, Issue 4, 2006, Pages 16-24

  Deutschmann, Bernd ^a   Sicard, Etienne ^b   Dhia, Sonia Ben ^b  

^a AMS AG   (Austria)

^b IRISA   (France)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 34249067066     PISSN: 15370755     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (6)

1. M. Camp et al.: "Influence of the Technology on the Destruction Effects of Semiconductors by Impact of EMP and UWB Pulses," 2002 IEEE Int. Symp. Electromag. Campat., 2002, 1, pp. 87-92.
2. M. Camp, H. Gerth, H. Garbe, and H. Haase: "Predicting the Breakdown Behavior of Microcontrollers under EMP/ UWB Impact Using a Statistical Analysis," IEEE Trans. Electromag. Compat., 2004, 46(3), pp. 368-79.
3. S. Ben Dhia, M. Ramdani, and E. Sicard: Electromagnetic Compatibility of Integrated Circuits, Springer, Dec. 2005.
4. "Integrated Circuits, Measurements of Susceptibility," IEC 62132, International Electrotechnical Commission, 2002, http://wwv.iec.ch (accessed 9/17/06).
5. "Road Vehicles - Electrical Disturbances from Conduction and Coupling, Part2: Electrical Transient Conduction along Supply Lines Only," ISO 7637-2:2004(E), 2nd ed., 2004-06-15, International Organization for Standardization, 2004, http://www.iso.ch (accessed 9/17/06).
6. B. Deutschmann: "A Comparison of Conducted Transient Disturbances and Failure Signatures for CMOS Integrated Circuits," Proc. EMC Compo 2005 (Munich, Germany), Nov. 2005.