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Volumn 3, Issue 6, 2006, Pages 205-215
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Rough surface adhesion mechanisms for wafer bonding
a a a a a a
a
CEA GRENOBLE
(France)
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Author keywords
[No Author keywords available]
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Indexed keywords
ROUGH SURFACE ADHESION;
SILICON WAFER BONDING;
NANOTECHNOLOGY;
SURFACE ROUGHNESS;
WAFER BONDING;
SILICON WAFERS;
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EID: 34249049530
PISSN: 19385862
EISSN: 19386737
Source Type: Conference Proceeding
DOI: 10.1149/1.2357071 Document Type: Conference Paper |
Times cited : (30)
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References (11)
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