Creation of a metallic micromachined chain mail fabric

Journal of Micromechanics and Microengineering

Volumn 17, Issue 3, 2007, Pages 551-556

  Engel, Jonathan ^a   Liu, Chang ^a  

^a United States of America   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC CONDUCTIVITY; FAILURE (MECHANICAL); MICROMACHINING; SHEET METAL;

CHAIN MAIL; MECHANICAL DEFORMATION;

FABRICS;

CONDUCTIVITY; DEFORMATION; METALLURGY;

EID: 34248999476     PISSN: 09601317     EISSN: 13616439     Source Type: Journal    
DOI: 10.1088/0960-1317/17/3/018     Document Type: Article

References (14)

1. Marculescu D, Marculescu R and Khosla P K 2001 Challenges and opportunities in electronic textiles modeling and optimization ACM IEEE Design Automation Conf.
2. De Rossi D, Santa A D and Mazzoldi A 1997 Dressware: wearable piezo- and thermoresistive fabrics for ergonomics and rehabilitation Int. Conf. of the IEEE Engineering in Medicine and Biology Society
3. Salonen P and Hurme L 2003 A novel fabric WLAN antenna for wearable applications IEEE Antennas and Propagation Society Int. Symp.
4. Kobayashi Y, Ishibashi S, Shirakawa K, Toriu J, Matsuki H and Murakami K 1992 New type micro cloth-inductor and transformer with thin amorphous wires and multi-thin coils IEEE Trans. Magn. 28 3012-4
5. Sergio M, Manaresi N, Campi F, Canegallo R, Tartagni M and Guerrieri R 2003 A dynamically reconfigurable monolithic CMOS pressure sensor for smart fabric IEEE J. Solid-State Circuits 38 966-75
6. Weber J L, Blanc D, Dittmar A, Comet B, Corroy C, Noury N, Baghai R, Vaysse S and Blinowska A 2003 VTAM-a new 'biocloth' for ambulatory telemonitoring IEEE EMBS Special Topic Conf. on Information Technology Applications in Biomedicine
7. Marculescu D et al 2003 Electronic textiles: a platform for pervasive computing Proc. IEEE 9 1995-2018
8. Post E R and Orth M 1997 'Smart fabric, or 'wearable clothing'' 1st Int. Symp. on Wearable Computers
9. Park S, Mackenzie K and Jayaraman S 2002 The wearable motherboard: a framework for personalized mobile information processing (PMIP) ACM IEEE Design Automation Conf.
10. Marculescu D, Marculescu R, Park S and Jayaraman S 2003 Ready to Ware IEEE Spectr. 40 28-32
11. Chen N, Engel J M, Pandya S and Liu C 2006 Flexible skin with two-axis bending capability made using weaving by lithography fabrication method IEEE Int. Conf. on MEMS (Istanbul, Turkey)
12. Jackman R J, Brittain S T, Adams A, Prentiss M G and Whitesides G M 1998 Design and fabrication of topologically complex, three-dimensional microstructures Science 280 2089-91
13. Engel J M, Chen J, Chen N, Pandya S and Liu C 2006 Multi-walled carbon nanotube filled conductive elastomers: materials and application to micro transducers IEEE Int. Conf. on MEMS (Istanbul, Turkey)
14. Engel J M, Chen J, Fan Z and Liu C 2005 Polymer micromachined multimodal tactile sensors Sensors Actuators A 117 50-61