Microstructure and thermal and electric conductivities of high dense Mo/Cu composites

Transactions of Nonferrous Metals Society of China (English Edition)

Volumn 15, Issue SPEC. ISS. 3, 2005, Pages 110-114

  Chen, Guo Qin ^a   Wu, Gao Hui ^a   Zhu, De Zhi ^a   Zhang, Qiang ^a   Jiang, Long Tao ^a  

^a HARBIN INSTITUTE OF TECHNOLOGY   (China)

Author keywords

Densification; Electric conductivity; Microstructure; Mo Cu composites; Thermal conductivity

Indexed keywords

EID: 34248638727     PISSN: 10036326     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (18)

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