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Volumn 35, Issue 8, 1999, Pages 39-48

Powder metallurgy processing of Mo-Cu for thermal management applications

Author keywords

[No Author keywords available]

Indexed keywords

COMPACTION; COOLING; INFILTRATION; INJECTION MOLDING; LOW TEMPERATURE PROPERTIES; METALLOGRAPHIC MICROSTRUCTURE; MOLYBDENUM ALLOYS; PARTICLE SIZE ANALYSIS; SINTERING; THERMAL CONDUCTIVITY OF SOLIDS; THERMAL CYCLING; THERMAL EXPANSION;

EID: 0343374888     PISSN: 08887462     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article
Times cited : (63)

References (10)
  • 1
    • 0342732801 scopus 로고
    • Properties and uses of the pseudobinary alloys of Cu with refractory metals
    • edited by H. Bildstein and H.M. Ortner, Metallweck Plansee GMBH, Reutte, Tirol, Austria
    • E. Kny, "Properties and Uses of the Pseudobinary Alloys of Cu with Refractory Metals," Proceedings of the 12th Inter. Plansee Seminar, edited by H. Bildstein and H.M. Ortner, Metallweck Plansee GMBH, Reutte, Tirol, Austria, 1990, vol. I, p. 763.
    • (1990) Proceedings of the 12th Inter. Plansee Seminar , vol.1 , pp. 763
    • Kny, E.1
  • 2
    • 0020166075 scopus 로고
    • Factors affecting tungsten-copper and tungsten-silver electrical contact materials
    • N.C. Kothari, "Factors Affecting Tungsten-Copper and Tungsten-Silver Electrical Contact Materials," Powder Metall. Int., 1982, vol. 14, p. 139.
    • (1982) Powder Metall. Int. , vol.14 , pp. 139
    • Kothari, N.C.1
  • 3
    • 0026994259 scopus 로고
    • Mo-Cu composites for electronic packaging applications
    • compiled by J. Capus and R.M. German, Metal Powder Industries Federation, Princeton, NJ
    • T.W. Kirk, S.G. Caldwell, and J.J. Oakes, "Mo-Cu Composites for Electronic Packaging Applications," Advances in Powder Metallurgy, compiled by J. Capus and R.M. German, Metal Powder Industries Federation, Princeton, NJ, 1992, vol. 9, p. 115.
    • (1992) Advances in Powder Metallurgy , vol.9 , pp. 115
    • Kirk, T.W.1    Caldwell, S.G.2    Oakes, J.J.3
  • 4
    • 0020726842 scopus 로고
    • Effect of various methods of charge preparation on sinterability in the molybdenum-copper system
    • V.V. Skorokhod, I.V. Uvarova, and T.E. Landau, "Effect of Various Methods of Charge Preparation on Sinterability in the Molybdenum-Copper System," Soviet Powder Met. Metal. Ceram., 1983, vol. 22, p. 185.
    • (1983) Soviet Powder Met. Metal. Ceram. , vol.22 , pp. 185
    • Skorokhod, V.V.1    Uvarova, I.V.2    Landau, T.E.3
  • 5
    • 21844480183 scopus 로고
    • W-Cu and Mo-Cu for microelectronic packaging applications: Processing fundamentals
    • compiled by A. Bose and R.J. Dowding, Metal Powder Industries Federation, Princeton, NJ
    • J.L. Johnson, K.F. Hens, and R.M. German, "W-Cu and Mo-Cu for Microelectronic Packaging Applications: Processing Fundamentals," Tungsten and Refractory Metals - 1994, compiled by A. Bose and R.J. Dowding, Metal Powder Industries Federation, Princeton, NJ, p. 246.
    • (1994) Tungsten and Refractory Metals - 1994 , pp. 246
    • Johnson, J.L.1    Hens, K.F.2    German, R.M.3
  • 7
    • 0026971796 scopus 로고    scopus 로고
    • Identification of the effects of key powder characteristics on powder injection molding
    • compiled by P.H. Booker, J. Gaspervich, and R.M. German, Metal Powder Industries Federation, Princeton, NJ
    • R.M. German and K.F. Hens, "Identification of the Effects of Key Powder Characteristics on Powder Injection Molding," 1992 Powder Injection Molding Symposium, compiled by P.H. Booker, J. Gaspervich, and R.M. German, Metal Powder Industries Federation, Princeton, NJ, p. 1.
    • 1992 Powder Injection Molding Symposium , pp. 1
    • German, R.M.1    Hens, K.F.2
  • 8
  • 10
    • 51249167334 scopus 로고
    • A model for the thermal properties of liquid phase sintered composites
    • R.M. German, "A Model for the Thermal Properties of Liquid Phase Sintered Composites," Metall. Trans. A, 1993, vol. 24A, p. 1745.
    • (1993) Metall. Trans. A , vol.24 A , pp. 1745
    • German, R.M.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.