Ballistic thermal conductance in a three-dimensional quantum wire modulated with stub structure

Applied Physics Letters

Volumn 90, Issue 19, 2007, Pages

  Peng, Xiao Fang ^a   Chen, Ke Qiu ^a   Zou, B S ^a   Zhang, Yan ^b  

^a HUNAN UNIVERSITY   (China)

^b CAPITAL NORMAL UNIVERSITY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

BOUNDARY CONDITIONS; MATHEMATICAL MODELS; THERMAL CONDUCTIVITY; THREE DIMENSIONAL; TWO DIMENSIONAL;

GEOMETRY DETAILS; STRESS FREE BOUNDARY CONDITIONS; STUB STRUCTURE; THREE DIMENSIONAL MODELS;

SEMICONDUCTOR QUANTUM WIRES;

EID: 34248349942     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.2737363     Document Type: Article

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