Recent progress in pulse reversal plating of copper for electronics applications

Transactions of the Institute of Metal Finishing

Volumn 85, Issue 1, 2007, Pages 40-45

  Leisner, P ^a,b   Moller P ^c   Fredenberg, M ^c   Belov, I ^b  

^a ACREO AB   (Sweden)

^b JÖNKÖPING UNIVERSITY   (Sweden)

^c Replisaurus Technologies   (Sweden)

Author keywords

Copper; Electroplating; Microelectronics; Packaging; Printed circuit board

Indexed keywords

ELECTRONICS ENGINEERING; ELECTRONICS PACKAGING; ELECTROPLATING; MICROELECTRONICS; PRINTED CIRCUIT BOARDS;

LOW FREQUENCY PLATING; PULSE REVERSAL PLATING; SUPERIMPOSED CATHODIC PULSATION;

COPPER PLATING;

EID: 34248174342     PISSN: 00202967     EISSN: None     Source Type: Journal    
DOI: 10.1179/174591907X161973     Document Type: Article

References (7)

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