Residual stress relaxation in the film/substrate system due to creep deformation

Journal of Applied Physics

Volumn 101, Issue 8, 2007, Pages

  Zhang, X C ^a,b   Xu, B S ^a   Wang, H D ^a   Wu, Y X ^b  

^a SHANGHAI JIAO TONG UNIVERSITY   (China)

^b NATIONAL KEY LABORATORY FOR REMANUFACTURING   (China)

Author keywords

[No Author keywords available]

Indexed keywords

CREEP; FILMS; HIGH TEMPERATURE EFFECTS; MATHEMATICAL MODELS; RELAXATION PROCESSES; SUBSTRATES;

BIAXIAL MODULUS; CREEP DEFORMATION; CREEP PARAMETERS; RESIDUAL STRESS RELAXATION;

RESIDUAL STRESSES;

EID: 34247608829     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.2717551     Document Type: Conference Paper

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