Characterizations of high resistivity TiNxOy thin films for applications in thin film resistors

Microelectronics Reliability

Volumn 47, Issue 4-5 SPEC. ISS., 2007, Pages 752-754

  Cuong, Nguyen Duy ^a   Kim, Dong Jin ^b   Kang, Byoung Don ^a,b   Kim, Chang Soo ^c   Yoon, Soon Gil ^a  

^a Chungnam National University   (South Korea)

^b KMC Technology Co Ltd   (South Korea)

^c Korea Research Institute of Standards and Science   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC CONDUCTIVITY; ELECTRODEPOSITION; RAPID THERMAL ANNEALING; RESISTORS; SHEET RESISTANCE; TITANIUM NITRIDE;

ANNEALING TEMPERATURE; TEMPERATURE COEFFICIENT OF RESISTANCE (TCR); THIN FILM RESISTORS; TITANIUM OXY NITRIDE;

THIN FILMS;

EID: 34247333042     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2007.01.014     Document Type: Article

References (7)

1. Greene J.E., Sundgren J.-E., Hultman L., Petrov I., and Bergstrom D.B. Appl Phys Lett 67 (1995) 2928
2. Cheng H.-E., Lee W.-J., and Hsu C.-M. Thin Solid Films 485 (2005) 59-65
3. Stallard J., Poulat S., and Teer D.G. Tribol Int 39 (2006) 159-166
4. Wang J.M., Liu W.G., and Mei T. Ceram Int 30 (2004) 1921-1924
5. Cuong N.D., Kim D.-J., Kang B.-D., Kim C.S., Yu K.-M., and Yoon S.-G. J Electrochem Soc 153 (2006) G164-G167
6. El-Kadry N., Ashour A., and Mahmoud S.A. Thin Solid Films 269 (1995) 112-116
7. Chen H.Y., and Lu F.H. J Vac Sci Technol A 23 (2005) 1006