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Volumn 18, Issue 3, 2007, Pages 852-858

Resonance ultrasonic vibrations for crack detection in photovoltaic silicon wafers

Author keywords

Acoustics; Crack detection; Defect; Micro crack; Photovoltaics; Resonance; Silicon; Solar cell; Wafer

Indexed keywords

CRACK DETECTION; FREQUENCY RESPONSE; MICROCRACKS; RESONANCE; SILICON WAFERS; SOLAR CELLS;

EID: 34247222015     PISSN: 09570233     EISSN: 13616501     Source Type: Journal    
DOI: 10.1088/0957-0233/18/3/038     Document Type: Article
Times cited : (82)

References (8)
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    • 34247252030 scopus 로고    scopus 로고
    • Optical u-crack detection in combination with stability testing for in-line inspection of wafers and cells
    • Rueland E, Herguth A, Trummer A, Wansleben S and Fath P 2005 Optical u-crack detection in combination with stability testing for in-line inspection of wafers and cells Proc. 20th EU PVSEC (Barcelona) pp 3242-5
    • (2005) Proc. 20th EU PVSEC , pp. 3242-3245
    • Rueland, E.1    Herguth, A.2    Trummer, A.3    Wansleben, S.4    Fath, P.5
  • 3
    • 22144480285 scopus 로고    scopus 로고
    • Photographic surveying of minority carrier diffusion length in polycrystalline silicon cells by electroluminescence
    • Fuyuki T, Kondo H, Yamazaki T, Takahashi Y and Uraoka Y 2005 Photographic surveying of minority carrier diffusion length in polycrystalline silicon cells by electroluminescence Appl. Phys. Lett. 86 262108
    • (2005) Appl. Phys. Lett. , vol.86
    • Fuyuki, T.1    Kondo, H.2    Yamazaki, T.3    Takahashi, Y.4    Uraoka, Y.5
  • 5
    • 32844474385 scopus 로고    scopus 로고
    • Resonance ultrasonic vibration diagnostics of elastic stress in full-size silicon wafers
    • Belyaev A, Polupan O, Ostapenko O, Hess D and Kalejs J P 2006 Resonance ultrasonic vibration diagnostics of elastic stress in full-size silicon wafers Semicond. Sci. Technol. 21 254-60
    • (2006) Semicond. Sci. Technol. , vol.21 , Issue.3 , pp. 254-260
    • Belyaev, A.1    Polupan, O.2    Ostapenko, O.3    Hess, D.4    Kalejs, J.P.5
  • 8
    • 33645132277 scopus 로고    scopus 로고
    • Crack detection and analyses using resonance ultrasonic vibrations in full-size crystalline silicon wafers
    • Belyaev A, Polupan O, Dallas W, Ostapenko S, Hess D and Wohlgemuth J 2006 Crack detection and analyses using resonance ultrasonic vibrations in full-size crystalline silicon wafers Appl. Phys. Lett. 88 111907
    • (2006) Appl. Phys. Lett. , vol.88
    • Belyaev, A.1    Polupan, O.2    Dallas, W.3    Ostapenko, S.4    Hess, D.5    Wohlgemuth, J.6


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.