Finite element simulations of the cyclic elastoplastic behaviour of copper thin films

Modelling and Simulation in Materials Science and Engineering

Volumn 15, Issue 1, 2007, Pages

  Šiška, Filip ^a   Forest, Samuel ^a   Gumbsch, Peter ^b,c   Weygand, Daniel ^b  

^a CENTRE DES MATÉRIAUX   (France)

^b UNIVERSITY OF KARLSRUHE   (Germany)

^c FRAUNHOFER INSTITUTE FOR MECHANICS OF MATERIALS IWM   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER COMPOUNDS; CRYSTAL ORIENTATION; FINITE ELEMENT METHOD; GRAIN SIZE AND SHAPE; PLASTICITY; THIN FILMS; DISPERSION HARDENING; GRAIN BOUNDARIES; PLASTIC DEFORMATION; PLASTICITY TESTING; POLYCRYSTALLINE MATERIALS; SURFACE ROUGHNESS;

CYCLIC ELASTOPLASTIC; CYCLIC HARDENING; CYCLIC STRAINING; FREE SURFACE;

ELASTOPLASTICITY; AGGREGATES;

COPPER THIN FILM; CRYSTAL PLASTICITY THEORY; CYCLIC HARDENING; CYCLIC LOADING CONDITIONS; CYCLIC STRAINING; ELASTOPLASTIC BEHAVIOUR; FINITE ELEMENT SIMULATIONS; FREE SURFACES; FREESTANDING FILMS; GRAIN ORIENTATION; IN-PLANE GRAIN SIZE; LARGE AGGREGATES; MULTICRYSTALLINE; RANDOM GRAINS; RANDOM ORIENTATIONS; STATISTICAL STRATEGIES; STRAIN HETEROGENEITY;

EID: 34247188144     PISSN: 09650393     EISSN: 1361651X     Source Type: Journal    
DOI: 10.1088/0965-0393/15/1/S17     Document Type: Conference Paper

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