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Volumn 459, Issue 1-2, 2007, Pages 244-250

The fabrication and property of SiC fiber reinforced copper matrix composites

Author keywords

Copper matrix composites; Densification; Interfacial modification; SiC fiber; Vacuum hot pressing

Indexed keywords

BONDING; DENSIFICATION; ELECTRIC CONDUCTIVITY; ELECTROPLATING; FIBER REINFORCED METALS; HOT PRESSING; INTERFACES (MATERIALS); MAGNETRON SPUTTERING; SILICON CARBIDE; THERMAL CONDUCTIVITY;

EID: 34247136824     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2007.01.010     Document Type: Article
Times cited : (41)

References (13)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.