|
Volumn 459, Issue 1-2, 2007, Pages 244-250
|
The fabrication and property of SiC fiber reinforced copper matrix composites
|
Author keywords
Copper matrix composites; Densification; Interfacial modification; SiC fiber; Vacuum hot pressing
|
Indexed keywords
BONDING;
DENSIFICATION;
ELECTRIC CONDUCTIVITY;
ELECTROPLATING;
FIBER REINFORCED METALS;
HOT PRESSING;
INTERFACES (MATERIALS);
MAGNETRON SPUTTERING;
SILICON CARBIDE;
THERMAL CONDUCTIVITY;
COPPER COATING;
FIBER REINFORCED COPPER MATRIX COMPOSITES;
FIBER-COATING METHOD;
FOIL-FIBER-FOIL METHOD;
INTERFACIAL BONDING STRENGTH;
METALLIC MATRIX COMPOSITES;
BONDING;
DENSIFICATION;
ELECTRIC CONDUCTIVITY;
ELECTROPLATING;
FIBER REINFORCED METALS;
HOT PRESSING;
INTERFACES (MATERIALS);
MAGNETRON SPUTTERING;
METALLIC MATRIX COMPOSITES;
SILICON CARBIDE;
THERMAL CONDUCTIVITY;
|
EID: 34247136824
PISSN: 09215093
EISSN: None
Source Type: Journal
DOI: 10.1016/j.msea.2007.01.010 Document Type: Article |
Times cited : (41)
|
References (13)
|