The interfacial reactions of infrared brazing Cu and Ti with two silver-based braze alloys

Journal of Alloys and Compounds

Volumn 372, Issue 1-2, 2004, Pages 148-157

  Shiue, R K ^a   Wu, S K ^b   Chan, C H ^b  

^a NATIONAL DONG HWA UNIVERSITY   (Taiwan)

^b NATIONAL TAIWAN UNIVERSITY   (Taiwan)

Author keywords

Bonding; Mechanical properties; Microstructure; Silver based braze alloys; Titanium and copper

Indexed keywords

BONDING; COPPER; INTERFACES (MATERIALS); MICROSTRUCTURE; REACTION KINETICS; SILVER ALLOYS; SUBSTRATES; TERNARY SYSTEMS; TITANIUM;

BRAZE ALLOYS; INFRARED BRAZING; INTERFACIAL REACTIONS; SILVER-BASED BRAZE ALLOYS;

BRAZING;

EID: 2342563737     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2003.09.155     Document Type: Article

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