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Volumn 200, Issue 1-4 SPEC. ISS., 2005, Pages 161-164
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Interface modification of SiC-fibre/copper matrix composites by applying a titanium interlayer
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Author keywords
Adhesion; Copper; Magnetron; Metal matrix composite; Silicon carbide; Titanium
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Indexed keywords
ADHESION;
CHEMICAL MODIFICATION;
COPPER;
ELECTROPLATING;
HOT ISOSTATIC PRESSING;
INTERFACES (MATERIALS);
MAGNETRON SPUTTERING;
SILICON CARBIDE;
TITANIUM;
COPPER MATRIX;
INTERFACE MODIFICATION;
TITANIUM INTERLAYER;
METALLIC MATRIX COMPOSITES;
SILICON CARBIDE;
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EID: 24644506665
PISSN: 02578972
EISSN: None
Source Type: Journal
DOI: 10.1016/j.surfcoat.2005.02.018 Document Type: Article |
Times cited : (43)
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References (15)
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