Investigation of tool geometry in nanometric cutting by molecular dynamics simulation

Journal of Materials Processing Technology

Volumn 129, Issue 1-3, 2002, Pages 105-108

  Han, X S ^a   Lin, B ^a   Yu, S Y ^a   Wang, S X ^a  

^a TIANJIN UNIVERSITY   (China)

Author keywords

Computer simulation; Machining mechanism; Molecular dynamics; Single crystal silicon; Ultraprecision machining

Indexed keywords

BRITTLENESS; COMPUTER SIMULATION; ENERGY DISSIPATION; INTEGRATED CIRCUITS; MACHINING; MOLECULAR DYNAMICS; SILICON WAFERS; SINGLE CRYSTALS; SURFACE ROUGHNESS;

ULTRAPRECISION MACHINING;

CUTTING TOOLS;

EID: 0037063879     PISSN: 09240136     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0924-0136(02)00585-X     Document Type: Conference Paper

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