Molecular dynamics simulation of the diffusion bonding and tensile behavior of a Cu-Al interface

Wuli Xuebao/Acta Physica Sinica

Volumn 56, Issue 1, 2007, Pages 407-412

  Liu, Hao ^a,b   Ke, Fu Jiu ^a,b   Pan, Hui ^a,b   Zhou, Min ^c  

^a BEIHANG UNIVERSITY   (China)

^b INSTITUTE OF MECHANICS   (China)

^c GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

Diffusion bonding; Ductility; Molecular dynamics; Tensile strength

Indexed keywords

EID: 33847788766     PISSN: 10003290     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (18)