Electrical contact resistance degradation of a hot-switched simulated metal MEMS contact

IEEE Transactions on Components and Packaging Technologies

Volumn 30, Issue 1, 2007, Pages 75-80

  Dickrell III, Daniel J ^a   Dugger, Michael T ^b  

^a UNIVERSITY OF FLORIDA   (United States)

^b SANDIA NATIONAL LABORATORIES   (United States)

Author keywords

Contact resistance; Gold; Microelectromechanical devices; Platinum; Surface contamination; Switches

Indexed keywords

CONTACT RESISTANCE; ELECTRIC CURRENTS; ELECTRIC SWITCHES; EQUIPMENT TESTING;

CURRENT LEVEL; ELECTRICAL CONTACT RESISTANCE DEGRADATION; ELECTRICAL CONTACT RESISTANCE TESTING; HOT-SWITCHING;

MEMS;

EID: 34147138241     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2007.892074     Document Type: Article

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