Wafer-level vacuum packaging for MEMS

Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films

Volumn 17, Issue 4, 1999, Pages 2295-2299

  Gooch, R ^a   Schimert, T ^a   McCardel, W ^a   Ritchey, B ^a   Gilmour, D ^b   Koziarz, W ^b  

^a RAYTHEON COMPANY   (United States)

^b AIR FORCE RESEARCH LABORATORY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ENABLING TECHNOLOGIES; ENVIRONMENTAL MONITORING; INERTIAL MEMS; KEY ISSUES; LOW COSTS; PACKAGING OPERATIONS; RADIO FREQUENCY-MEMS; TECHNOLOGY DEVELOPMENT; UNCOOLED DETECTORS; VACUUM PACKAGE; VACUUM PACKAGING; WAFER FAB; WAFER LEVEL PACKAGING; WAFER LEVEL VACUUM PACKAGING;

ACCELEROMETERS; MICROELECTROMECHANICAL DEVICES; PACKAGING; VACUUM; VACUUM TECHNOLOGY;

ELECTRONICS PACKAGING;

EID: 0000474427     PISSN: 07342101     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.581763     Document Type: Conference Paper

References (1)

1. T. Schimert, R. Gooch, W. McCardel, R. Terrill, S. Borrello, J. Whitney, P. Kroger, and A. Ahne, Proceedings of the 1996 International Specialty Conference on Optical Sensing of Environmental and Process Monitoring, Air & Waste Management Association, 1997, pp. 67-77.