Packaging of optical MEMS devices

Journal of Electronic Packaging

Volumn 125, Issue 3, 2003, Pages 325-328

  Low, Yee L ^a   Scotti, Ronald E ^a   Ramsey, David A ^a   Bolle, Cristian A ^a   O'Neill, Steven P ^b   Nguyen, Khanh C ^b  

^a NOKIA RESEARCH CENTER   (United States)

^b AGERE SYSTEMS   (United States)

Author keywords

Ceramic; Hermeticity; LTCC; Optical MEMS; Packaging

Indexed keywords

ANTIREFLECTION COATINGS; CERAMIC MATERIALS; DIMENSIONAL STABILITY; HERMETIC SEALS; METALLIZING; MICROELECTROMECHANICAL DEVICES; RELIABILITY; SUBSTRATES;

ANTI REFLECTION COATED WINDOWS; HIGH TEMPERATURE CO FIRED CERAMICS; LOW TEMPERATURE CO FIRED CERAMICS;

ELECTRONICS PACKAGING;

EID: 0141884179     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.1535933     Document Type: Article

References (6)

1. Walker, J. A., 2000, "The Future of MEMS in Telecommunications Networks," J. Micromech. Microeng., 10, R1-R7.
2. Dakuginow, S., 2000, "Packaging the Digital Micromirror Device," 2nd IEEE Optoelectronics Packaging Workshop, ID October 4-6.
3. Greenhouse, H. 1999, Hermeticity of Electronics Packages, Noyes Publications, Park Ridge, NJ.
4. Ford, J. E., and Walker, J. A., 1998, "Dynamic Spectral Power Equalization Using Micro-Opto-Mechanics," IEEE Photonics Technol. Lett., 10(10), Oct., pp. 1440-1442.
5. Neilson, D. T., Aksyuk, V. A., Arney, S., Basavanhally, N. R., Bhalla, K. S., Bishop, D. J., Boie, B. A., Bolle, C. A., Gates, J. V., Gottlieb, A. M., Hickey, J. P., Jackman, N. A., Kolodner, P. R., Korotky, S. K., Mikkelsen, B., Pardo, F., Raybon, G., Ruel, R., Scotti, R. E., Van Blarcum, T. W., Zhang, L., and Giles, C. R., 2000, "Fully provisioned 112×112 micro-mechanical optical crossconnect with 35.8Tb/s demonstrated capacity," Proc., Optical Fiber Conference, Baltimore, MD.
6. Dupont Microcircuit Materials, http://www.dupont.com/mcm/product.tape.html.