Feature analysis and classification of manufacturing signatures based on semiconductor wafermaps

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 3029, Issue , 1997, Pages 14-25

  Tobin, Kenneth W ^a   Gleason, Shaun S ^a   Karnowski, Thomas P ^a   Cohen, Susan L ^b  

^a OAK RIDGE NATIONAL LABORATORY   (United States)

^b SEMATECH   (United States)

Author keywords

Classification; Electronic wafermap; Feature analysis; Feature ranking; Feature selection; Fuzzy pair wise classifier; Pattern recognition; Semiconductor; Wafer inspection

Indexed keywords

COMPUTER VISION; DEFECTS; FEATURE EXTRACTION; INSPECTION; PATTERN RECOGNITION; SEMICONDUCTOR DEVICE MANUFACTURE; SEMICONDUCTOR MATERIALS; SILICON WAFERS;

AUTOMATIC ANALYSIS TOOLS; COOPERATIVE RESEARCH PROJECT; ELECTRONIC WAFERMAP; FEATURE ANALYSIS; FEATURE RANKING; MANUFACTURING SIGNATURES; OAK RIDGE NATIONAL LABORATORY; WAFER INSPECTION;

CLASSIFICATION (OF INFORMATION);

EID: 34047253760     PISSN: 0277786X     EISSN: 1996756X     Source Type: Conference Proceeding    
DOI: 10.1117/12.271241     Document Type: Conference Paper

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