Directional dilation for the connection of piece-wise objects: a semiconductor manufacturing case study

IEEE International Conference on Image Processing

Volumn 3, Issue , 1996, Pages 9-12

  Gleason, Shaun S ^a   Tobin, Kenneth W ^a  

^a OAK RIDGE NATIONAL LABORATORY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALGORITHMS; BINARY CODES; FEATURE EXTRACTION; GRAVITATIONAL EFFECTS; IMAGE ANALYSIS; IMAGE PROCESSING; PIECEWISE LINEAR TECHNIQUES; SEMICONDUCTOR DEVICE MANUFACTURE; STANDARDS;

BINARY IMAGES; DILATION VECTORS; INTELLIGENT DILATION; MORPHOLOGICAL ANALYSIS; PIECE WISE OBJECTS;

MATHEMATICAL MORPHOLOGY;

EID: 0030402765     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)