Microstructure evolution and reaction mechanism during reactive joining of TiAl intermetallic to TiC cermet using Ti-Al-C-Ni interlayer

Journal of Alloys and Compounds

Volumn 436, Issue 1-2, 2007, Pages 298-302

  Feng, J C ^a   Cao, J ^a   Li, Z R ^a  

^a HARBIN INSTITUTE OF TECHNOLOGY   (China)

Author keywords

Intermetallics; Metal matrix composites; Microstructure; Scanning electron microscopy; SHS

Indexed keywords

CERMETS; MICROSTRUCTURE; REACTION KINETICS; RESIDUAL STRESSES; SYNTHESIS (CHEMICAL); TITANIUM COMPOUNDS;

INTERFACIAL JOINING; METAL MATRIX COMPOSITES; SHS;

INTERMETALLICS;

EID: 34047246525     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2006.07.040     Document Type: Article

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