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Volumn , Issue , 2006, Pages 2811-2815

Active electrode arrays by chip embedding in a flexible Silicone carrier

Author keywords

[No Author keywords available]

Indexed keywords

EMBEDDED SYSTEMS; IMPLANTS (SURGICAL); MICROPROCESSOR CHIPS; PROSTHETICS; SILICON;

EID: 34047179113     PISSN: 05891019     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IEMBS.2006.260786     Document Type: Conference Paper
Times cited : (6)

References (13)
  • 1
    • 0032963438 scopus 로고    scopus 로고
    • The past, present, and future of cochlear prostheses
    • May/Jun
    • F. Spelman, "The past, present, and future of cochlear prostheses," Engineering in Medicine and Biology Magazine, IEEE, vol. 18, no.3, pp. 27-33, May/Jun 1999.
    • (1999) Engineering in Medicine and Biology Magazine, IEEE , vol.18 , Issue.3 , pp. 27-33
    • Spelman, F.1
  • 3
    • 28444487187 scopus 로고    scopus 로고
    • Packaging of Bio-MEMS: Strategies, technologies, and applications
    • Nov
    • T. Velten et al., "Packaging of Bio-MEMS: strategies, technologies, and applications," IEEE Trans. Advanced Packaging, vol. 28, no. 4, pp. 533-546, Nov. 2005.
    • (2005) IEEE Trans. Advanced Packaging , vol.28 , Issue.4 , pp. 533-546
    • Velten, T.1
  • 4
    • 33847719891 scopus 로고    scopus 로고
    • An integrated position-sensing system for a MEMS-based cochlear implant
    • presented at the, Washington DC, Dec
    • J. Wang, M. Gulari, K. D. Wise, "An integrated position-sensing system for a MEMS-based cochlear implant," presented at the IEEE International Electron Devices Meeting 2005, Washington DC, Dec. 2005.
    • (2005) IEEE International Electron Devices Meeting 2005
    • Wang, J.1    Gulari, M.2    Wise, K.D.3
  • 6
    • 33845186484 scopus 로고    scopus 로고
    • A 32-site 4-channel cochlear electrode array
    • presented at the, San Francisco, CA, Feb
    • P. T. Bhatti et al., "A 32-site 4-channel cochlear electrode array," presented at the 2006 IEEE International Solid-State Circuits Conference, San Francisco, CA, Feb. 2006.
    • (2006) 2006 IEEE International Solid-State Circuits Conference
    • Bhatti, P.T.1
  • 8
    • 0034822277 scopus 로고    scopus 로고
    • O. Vendier, M. Huan, C. Drevofi, J.L. Cazaux, E. Beyne, R. Van Hoof, A. Marty, S. Pinel, J. Tasselli, S. Marco, J. R. Morante, Ultra thin electronics for space applications, Electronic Components and Technology Conference, 2001. Proceedings., 51st, pp. 767-771, 2001.
    • O. Vendier, M. Huan, C. Drevofi, J.L. Cazaux, E. Beyne, R. Van Hoof, A. Marty, S. Pinel, J. Tasselli, S. Marco, J. R. Morante, "Ultra thin electronics for space applications," Electronic Components and Technology Conference, 2001. Proceedings., 51st, vol., pp. 767-771, 2001.
  • 9
    • 34047136178 scopus 로고    scopus 로고
    • Method of transferring ultra-thin substrates and applications of the method to the manufacture of a multi-layer thin film device,
    • EP patent application 1041620, US patents US 6506664, US 6730997
    • E. Beyne, A. Coella-Vera, "Method of transferring ultra-thin substrates and applications of the method to the manufacture of a multi-layer thin film device," EP patent application 1041620, US patents US 6506664, US 6730997.
    • Beyne, E.1    Coella-Vera, A.2
  • 13
    • 18844432122 scopus 로고    scopus 로고
    • S. Metz, A. Bertsch, P. Renaud, Partial release and detachment of microfabricated metal and polymer structures by anodic metal dissolution, Microelectromechanical Systems, Journal of, 14, no.2, pp. 383-391, April 2005.
    • S. Metz, A. Bertsch, P. Renaud, "Partial release and detachment of microfabricated metal and polymer structures by anodic metal dissolution," Microelectromechanical Systems, Journal of, vol.14, no.2, pp. 383-391, April 2005.


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.