Ultra-thin pocket embedding package for system in package

Electronics Letters

Volumn 43, Issue 6, 2007, Pages 325-327

  Kim, K M ^a   Sohn, B ^a   Yook, J M ^a   Yeo, S K ^a   Kwon, Y S ^a  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; HEAT LOSSES; MICROPROCESSOR CHIPS; MONOLITHIC MICROWAVE INTEGRATED CIRCUITS; SUBSTRATES;

ANODIZED ALUMINIUM; POCKET EMBEDDING PACKAGES; THERMAL DISSIPATION;

CHIP SCALE PACKAGES;

EID: 34047146477     PISSN: 00135194     EISSN: None     Source Type: Journal    
DOI: 10.1049/el:20073758     Document Type: Article

References (8)

1. Cavin, R., and Liu, W.: ' Emerging technologies: designing low power digital system ', (IEEE Press, Piscataway, NJ, 1996)
2. Dougherty, J.: et al. ' The NEMI roadmap: integrated passives technology and economics ', Proc. 2003 CARTS Conf, Scottsdale, AZ, USA, March, 2003
3. Ulrich, R.: ' Moving embedded passives from the lab to the fab ', CircuiTree, 2003, 16, (3), p. 64 1059-843X
4. Shin, S.-H., Lee, J.H., Sohn, B.-I., Ryu, S.-H., and Kwon, Y.-S.: ' PCS power amplifier module package using selectively anodized aluminum substrate ', European Microwave Conf., September, 2006, p. 1767-1770
5. Shin, S.-H., and Kown, Y.-S.: ' Selectively anodized substrates for microwave power module package ', 2005 Electronic Components and Technology Conf., 2005, p. 1904-1908
6. Tan, S., and Reed, M.: ' High aspect ratio microstructures on porous anodic aluminum oxide ', Micro-electro Mechanical Systems, (MEMS'95), 1995, p. 267-272
7. 2 solutions ', Corros. Sci., 1970, 10, p. 617-627 0010-938X
8. Lee, J.-H., Shin, S.-H., Kim, K.M., and Kwon, Y.-S.: ' Fabrication and analysis of high-Q inductor on anodized aluminum for high power package ', European Microwave Conf., September, 2006, p. 1387-1390