Epitaxy-like protective layers for high-performance low-cost Au/Pd/Ni preplated Cu alloy leadframes

IEEE Transactions on Advanced Packaging

Volumn 29, Issue 4, 2006, Pages 683-689

  Liu, Lilin ^a   Liu, Deming ^b   Fu, Ran ^b   Kwan, Yiu Fai ^b   Yau, Chun Ho ^b   Zhang, Tong Yi ^a  

^a HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Hong Kong)

^b ASM Assembly Automation Ltd   (Hong Kong)

Author keywords

Epitaxy like film; High resolution transmission electron microscopy (HRTEM); Preplated leadframe; Texture

Indexed keywords

COPPER ALLOYS; CRYSTAL LATTICES; CRYSTAL MICROSTRUCTURE; ELECTROPLATING; EPITAXIAL GROWTH; TRANSMISSION ELECTRON MICROSCOPY;

EPITAXY-LIKE FILM; HIGH RESOLUTION TRANSMISSION ELECTRON MICROSCOPY (HRTEM); PREPLATED LEADFRAME; SOLDERABILITY TEST; WIRE PULL TEST;

ELECTRONICS PACKAGING;

EID: 34047144939     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2006.879421     Document Type: Article

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