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Volumn 8, Issue 11, 1997, Pages 32-34,-36
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Impact of palladium lead frames on PCA manufacturing
a
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Author keywords
[No Author keywords available]
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Indexed keywords
ASSEMBLY;
CERAMIC MATERIALS;
ELECTRONICS PACKAGING;
LEAD PLATING;
OPTICAL MICROSCOPY;
PALLADIUM COMPOUNDS;
PRINTED CIRCUIT BOARDS;
SCANNING ELECTRON MICROSCOPY;
SOLDERED JOINTS;
SOLDERING;
SURFACE MOUNT TECHNOLOGY;
WETTING;
CERAMIC PLATE TEST;
PALLADIUM LEAD FRAMES;
PRINTED CIRCUIT MANUFACTURE;
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EID: 0031261337
PISSN: 10540407
EISSN: None
Source Type: Trade Journal
DOI: None Document Type: Article |
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Times cited : (5)
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References (0)
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