Effects of phase change of Pb-free flip-chip solders during board-level interconnect reflow

IEEE Transactions on Advanced Packaging

Volumn 30, Issue 1, 2007, Pages 38-43

  Chung, Soonwan ^a   Tang, Zhenming ^a   Park, Seungbae ^a  

^a State University of New York   (United States)

Author keywords

Contact analysis; Flip chip; Interfacial failure; Pb free solder; Phase change; Reflow process; Strain energy release rate; Underfill fracture; Volume expansion

Indexed keywords

CHIP SCALE PACKAGES; COMPUTER SIMULATION; CRACKS; DELAMINATION; FINITE ELEMENT METHOD; LEAD ALLOYS; MATHEMATICAL MODELS; PHASE INTERFACES; SOLDERING ALLOYS;

CONTACT ANALYSIS; FLIP-CHIP SOLDERS; INTERFACIAL FAILURE; REFLOW PROCESS; STRAIN ENERGY RELEASE RATE; UNDERFILL FRACTURE; VOLUME EXPANSION;

FLIP CHIP DEVICES;

EID: 33947415367     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2006.890207     Document Type: Article

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