Comparative study of feeding techniques for three-dimensional cavity resonators at 60 GHz

IEEE Transactions on Advanced Packaging

Volumn 30, Issue 1, 2007, Pages 115-123

  Lee, Jong Hoon ^a   Pinel, Stéphane ^a   Papapolymerou, John ^a   Laskar, Joy ^a   Tentzeris, Manos M ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

3 D integration; Cavity resonators; Low temperature cofired ceramic (LTCC); Millimeter wave (mmW); Probe excitation; Slot excitation; System on package (SOP); Unloaded quality factor (Qu)

Indexed keywords

BANDWIDTH; COMPUTER SIMULATION; COUPLED CIRCUITS; ELECTRIC NETWORK TOPOLOGY; MILLIMETER WAVES; MULTICHIP MODULES;

LOW-TEMPERATURE COFIRED CERAMIC (LTCC); PROBE EXCITATION; SLOT EXCITATION; SYSTEM-ON-PACKAGE (SOP); UNLOADED QUALITY FACTOR (QU);

CAVITY RESONATORS;

EID: 33947369916     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2006.890205     Document Type: Article

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