Ferroelectrets with improved thermal stability made from fused fluorocarbon layers

Journal of Applied Physics

Volumn 101, Issue 5, 2007, Pages

  Zhang, X ^a,b   Hillenbrand, J ^a   Sessler, G M ^a  

^a DARMSTADT UNIVERSITY OF TECHNOLOGY   (Germany)

^b TONGJI UNIVERSITY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

FLUOROCARBONS; HIGH TEMPERATURE EFFECTS; INTERFACES (MATERIALS); MICROPHONES; POLYTETRAFLUOROETHYLENES; THERMODYNAMIC STABILITY;

FERROELECTRETS; PIEZOELECTRIC COEFFICIENT; THERMALLY-STIMULATED DISCHARGE MEASUREMENTS;

ELECTRETS;

EID: 33947308111     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.2562413     Document Type: Article

References (43)

1. R. Gerhard-Multhaupt, IEEE Trans. Dielectr. Electr. Insul. 9, 850 (2002).
2. S. Bauer, R. Gerhard-Multhaupt, and G. M. Sessler, Phys. Today 57 (2), 37 (2004).
3. Q. M. Zhang and J. Scheinbeim, Electroactive Polymer (EAP) Actuators as Artificial Muscles-Reality, Potential, and Challenges, edited by, Y. Bar-Cohen, 2nd ed. (SPIE, Bellingham, WA, 2004), Vol. PM136, pp. 95-150.
4. S. Bauer, IEEE Trans. Dielectr. Electr. Insul. 13, 953 (2006).
5. M. Paajanen, M. Wegener, and R. Gerhard-Multhaupt, J. Phys. D 34, 2482 (2001).
6. X. Zhang, J. Hillenbrand, and G. M. Sessler, J. Phys. D 37, 2146 (2004).
7. M. Wegener, W. Wirges, J. Fohlmeister, B. Tiersch, and R. Gerhard-Multhaupt, J. Phys. D 37, 623 (2004).
8. X. Zhang, G. M. Sessler, and J. Hillenbrand, J. Electrost. 65, 94 (2007).
9. J. Hillenbrand, X. Zhang, Y. Zhang, and G. M. Sessler, 2003 Annual Report on IEEE Conference on Electrical Insulation and Dielectric Phenomena (IEEE, New York, 2003), pp. 40-43.
10. W. Künstler, Z. Xia, T. Weinhold, A. Pucher, and R. Gerhard-Multhaupt, Appl. Phys. A: Mater. Sci. Process. 70, 5 (2000).
11. Z. Xia, S. Ma, X. Qiu, and Y. Zhang, J. Electrost. 58, 265 (2003).
12. G. S. Neugschwandtner, R. Schwödiauer, S. Bauer-Gogonea, and S. Bauer, Appl. Phys. A: Mater. Sci. Process. 70, 1 (2000).
13. R. Schwödiauer, G. S. Neugschwandtner, K. Schrattbauer, M. Lindner, M. Vieytes, S. Bauer-Gogonea, and S. Bauer, IEEE Trans. Dielectr. Electr. Insul. 7, 578 (2000).
14. J. Hillenbrand and G. M. Sessler, 2002 Annual Report on IEEE Conference on Electrical Insulation and Dielectric Phenomena (IEEE, New York, 2002), pp. 287-290.
15. J. Hillenbrand and G. M. Sessler, IEEE Trans. Dielectr. Electr. Insul. 11, 72 (2004).
16. Z. Hu and H. von Seggern, J. Appl. Phys. 99, 024102-1 (2006).
17. R. Gerhard-Multhaupt, IEEE Trans. Dielectr. Electr. Insul. 7, 480 (2000).
18. R. A. C. Altafim, C. Dias, L. Goncalves Neto, H. C. Basso, and C. Muratami, 2003 Annual Report on IEEE Conference on Electrical Insulation and Dielectric Phenomena (IEEE, New York, 2003), pp. 225-228.
19. R. A. C. Altafim, H. C. Basso, L. Goncalves Neto, L. Lima, R. A. P. Altafim, and C. V. de Equino, 2005 Annual Report on IEEE Conference on Electrical Insulation and Dielectric Phenomena (IEEE, New York, 2005), pp. 669-672.
20. X. Zhang, J. Hillenbrand, and G. M. Sessler, Appl. Phys. A: Mater. Sci. Process. 84, 139 (2006).
21. R. A. C. Altafim, H. C. Basso, R. A. P. Altafim, L. Lima, C. V. de Aquino, L. Goncalves Neto, and R. Gerhard-Multhaupt, IEEE Trans. Dielectr. Electr. Insul. 13, 979 (2006).
22. A. Mellinger, M. Wegener, W. Wirges, and R. Gerhard-Multhaupt, Appl. Phys. Lett. 79, 1852 (2001).
23. E. Saarimäki, IEEE Trans. Dielectr. Electr. Insul. 13, 963 (2006).
24. G. C. Montanari, D. Fabiani, F. Ciani, and M. Paajanen, 2005 Annual Report on IEEE Conference on Electrical Insulation and Dielectric Phenomena (IEEE, New York, 2005), pp. 552-556.
25. M. Wegener, W. Wirges, J. P. Dietrich, and R. Gerhard-Multhaupt, Proceedings of the 12th International Symposium on Electrets (Salvador, Bahia, Brazil, 2005), pp. 28-30.
26. G. M. Sessler and J. Hillenbrand, Appl. Phys. Lett. 75, 3405 (1999).
27. M. Paajanen, J. Lekkala, and K. Kirjavainen, Sens. Actuators, A 84, 95 (2000).
28. Electrets, edited by, G. M. Sessler, (Laplacian, Morgan Hill, 1999), Vol. 1.
29. M. Lindner, S. Bauer-Gogonea, and S. Bauer, J. Appl. Phys. 91, 5283 (2002).
30. J. Hillenbrand and G. M. Sessler, IEEE Trans. Dielectr. Electr. Insul. 7, 537 (2000).
31. J. Hillenbrand and G. M. Sessler, J. Acoust. Soc. Am. 116, 3267 (2004).
32. H. von Seggern and J. E. West, J. Appl. Phys. 55, 2754 (1984).
33. H. von Seggern, J. Appl. Phys. 50, 2817 (1979).
34. R. L. Remke and H. von Seggern, J. Appl. Phys. 54, 5262 (1983).
35. W. Künstler and R. Gerhard-Multhaupt, 1997 Annual Report on Conference on Electrical Insulation and Dielectric Phenomena (IEEE, New York, 1997), pp. 72-75.
36. W. Künstler and R. Gerhard-Multhaupt, 1998 Annual Report on Conference on Electrical Insulation and Dielectric Phenomena (IEEE, New York, 1998), pp. 613-616.
37. R. Schwödiauer, S. Bauer-Gogonea, S. Bauer, J. Heitz, E. Arenholz, and D. Bäuerle, Appl. Phys. Lett. 73, 2941 (1998).
38. J. Hillenbrand, G. M. Sessler, and X. Zhang, J. Appl. Phys. 98, 064105 (2005).
39. IEEE Standard Piezoelectricity, ANSI/IEEE SWtd. 176-1987.
40. N. Lagakos, J. Jarzynski, J. H. Cole, and J. A. Bucaro, J. Appl. Phys. 59, 4017 (1986).
41. X. Zhang, J. Hillenbrand, and G. M. Sessler, Appl. Phys. Lett. 85, 1226 (2004).
42. M. Wegener, Appl. Phys. Lett. 84, 392 (2004).
43. J. Hillenbrand and G. M. Sessler, IEEE Trans. Dielectr. Electr. Insul. 13, 973 (2006).