Ferroelectrets: Soft Electroactive Foams for Transducers

Physics Today

Volumn 57, Issue 2, 2004, Pages 37-43

  Bauer, Siegfried ^a   Gerhard Multhaupt, Reimund ^b   Sessler, Gerhard M ^c  

^a JOHANNES KEPLER UNIVERSITY LINZ   (Austria)

^b UNIVERSITY OF POTSDAM   (Germany)

^c DARMSTADT UNIVERSITY OF TECHNOLOGY   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRETS; ELECTRIC CHARGE; ELECTROMECHANICAL DEVICES; ELECTRON EMISSION; FREQUENCY RESPONSE; MICROPHONES; PERMANENT MAGNETS; PIEZOELECTRICITY; POLARIZATION; SENSORS; TRANSDUCERS;

MECHANICAL SIGNALS; ULTRASONIC SENSORS;

FERROELECTRIC MATERIALS;

EID: 1242265501     PISSN: 00319228     EISSN: None     Source Type: Trade Journal    
DOI: 10.1063/1.1688068     Document Type: Article

References (24)

1. L. J. Gibson, M. F. Ashby, Cellular Solids: Structure and Properties, Cambridge U. Press, New York (1999).
2. For an up-to-date reference, see M. Lindner et al., IEEE Trans. Dielectr. Electr. Insul. (in press).
3. G. M. Sessler, ed., Electrets, vol. 1, 3rd ed., Laplacian Press, Morgan Hill, CA (1998); R. Gerhard-Multhaupt, ed., Electrets, vol. 2, 3rd ed., Laplacian Press, Morgan Hill, CA(1999), and references therein.
4. G. M. Sessler, ed., Electrets, vol. 1, 3rd ed., Laplacian Press, Morgan Hill, CA (1998); R. Gerhard-Multhaupt, ed., Electrets, vol. 2, 3rd ed., Laplacian Press, Morgan Hill, CA(1999), and references therein.
5. R. Hayakawa, Y. Wada, Adv. Polym. Sci. 119, 1 (1973); J. J. Crosnier, F. Micheron, G. Dreyfus, J. Lewiner, J. Appl. Phys. 47, 4798 (1976); R. Kacprzyk, E. Motyl, J. B. Gajewski, A. Pasternak, J. Electrost. 35, 161 (1995).
6. R. Hayakawa, Y. Wada, Adv. Polym. Sci. 119, 1 (1973); J. J. Crosnier, F. Micheron, G. Dreyfus, J. Lewiner, J. Appl. Phys. 47, 4798 (1976); R. Kacprzyk, E. Motyl, J. B. Gajewski, A. Pasternak, J. Electrost. 35, 161 (1995).
7. R. Hayakawa, Y. Wada, Adv. Polym. Sci. 119, 1 (1973); J. J. Crosnier, F. Micheron, G. Dreyfus, J. Lewiner, J. Appl. Phys. 47, 4798 (1976); R. Kacprzyk, E. Motyl, J. B. Gajewski, A. Pasternak, J. Electrost. 35, 161 (1995).
8. K. Kirjavainen, "Electromechanical film and procedure for manufacturing same," US Patent 4,654,546 (31 Mar. 1987); A. Savolainen, K. Kirjavainen, J. Macromol. Sci., Chem. A26, 583 (1989); M. K. Hämäläinen et al., Rev. Sci. Instrum. 67, 1598 (1996).
9. K. Kirjavainen, "Electromechanical film and procedure for manufacturing same," US Patent 4,654,546 (31 Mar. 1987); A. Savolainen, K. Kirjavainen, J. Macromol. Sci., Chem. A26, 583 (1989); M. K. Hämäläinen et al., Rev. Sci. Instrum. 67, 1598 (1996).
10. K. Kirjavainen, "Electromechanical film and procedure for manufacturing same," US Patent 4,654,546 (31 Mar. 1987); A. Savolainen, K. Kirjavainen, J. Macromol. Sci., Chem. A26, 583 (1989); M. K. Hämäläinen et al., Rev. Sci. Instrum. 67, 1598 (1996).
11. A. A. Konsta, A. Vassilikou-Dova, K. Vartzeli-Nikaki, eds., Proc. 10th International Symposium on Electrets, Institute of Electrical and Electronics Engineers, Piscataway, NJ (1999). See also R. J. Fleming, ed., Proc. 11th International Symposium on Electrets, Institute of Electrical and Electronics Engineers, Piscataway, NJ (2002), and dedicated issues of IEEE Trans. Dielectr. Electr. Insul. 1 (August 2000) and 11 (April 2004).
12. A. A. Konsta, A. Vassilikou-Dova, K. Vartzeli-Nikaki, eds., Proc. 10th International Symposium on Electrets, Institute of Electrical and Electronics Engineers, Piscataway, NJ (1999). See also R. J. Fleming, ed., Proc. 11th International Symposium on Electrets, Institute of Electrical and Electronics Engineers, Piscataway, NJ (2002), and dedicated issues of IEEE Trans. Dielectr. Electr. Insul. 1 (August 2000) and 11 (April 2004).
13. A. A. Konsta, A. Vassilikou-Dova, K. Vartzeli-Nikaki, eds., Proc. 10th International Symposium on Electrets, Institute of Electrical and Electronics Engineers, Piscataway, NJ (1999). See also R. J. Fleming, ed., Proc. 11th International Symposium on Electrets, Institute of Electrical and Electronics Engineers, Piscataway, NJ (2002), and dedicated issues of IEEE Trans. Dielectr. Electr. Insul. 1 (August 2000) and 11 (April 2004).
14. R. Gerhard-Multhaupt, IEEE Trans. Dielectr. Electr. Insul. 9, 850 (2002).
15. M. Paajanen, M. Wegener, R. Gerhard-Multhaupt, J. Phys. D: Appl. Phys. 34, 2482 (2001).
16. M. Lindner et al., J. Appl. Phys. 91, 5283 (2002).
17. J. Hillenbrand, G. M. Sessler, 2000 Annual Report Conference on Electrical Insulation and Dielectric Phenomena, Institute of Electrical and Electronics Engineers, Piscataway, NJ (2000), p. 161.
18. G. M. Sessler, J. Hillenbrand, Appl. Phys. Lett. 75, 3405 (1999).
19. A. Mellinger, IEEE Trans. Dielectr. Electr. Insul. 10, 842 (2003); G. S. Neugschwandtner et al., Appl. Phys. Lett. 77, 3827 (2000).
20. A. Mellinger, IEEE Trans. Dielectr. Electr. Insul. 10, 842 (2003); G. S. Neugschwandtner et al., Appl. Phys. Lett. 77, 3827 (2000).
21. J. Hillenbrand, G. M. Sessler, IEEE Trans. Dielectr. Electr. Insul. (in press).
22. R. Kressmann, J. Acoust. Soc. Am. 109, 1412 (2001).
23. For additional information, see http://www.emfit.com/applications.shtml.
24. M. E. Lines, A. M. Glass, Principles and Applications of Ferroelectrics and Related Materials, Oxford U. Press, New York (2001).