Application of thermoelectrics to cooling electronics: Review and prospects

International Conference on Thermoelectrics, ICT, Proceedings

Volumn , Issue , 1999, Pages 270-279

  Chu, R C ^a   Simons, R E ^a  

^a IBM   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COOLING SYSTEMS; HEAT FLUX; INTEGRATED CIRCUIT MANUFACTURE; MULTICHIP MODULES; NUMERICAL METHODS; THERMAL VARIABLES CONTROL;

ELECTRONIC COOLING;

THERMOELECTRIC EQUIPMENT;

EID: 0033297886     PISSN: 10942734     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (19)